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TGF4212SCMX

Texas Instruments

TGF4212SCMX by Texas Instruments

TGF4212SCMX by Texas Instruments is an N-CHANNEL RF Power FET for AMPLIFIER applications. Features include 10V DS Breakdown Voltage, DEPLETION MODE operation, and KU BAND frequency band. This RECTANGULAR chip with GALLIUM ARSENIDE technology has 4 terminals and is surface mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,879 parts In-Stock

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5,879

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Digiode

USA . 440 parts In-Stock

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440

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,501 parts In-Stock

1+ parts

$1.031

100+ parts

-

1k+ parts

$1.899

10k+ parts

-

1,501

$1.031

-

$1.899

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DigiPath Technology Company

USA . 1,191 parts In-Stock

1+ parts

$1.135

100+ parts

$1.044

1k+ parts

-

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1,191

$1.135

$1.044

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ChromeModa Solutions

Germany . 3,255 parts In-Stock

1+ parts

$1.158

100+ parts

$0.950

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-

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3,255

$1.158

$0.950

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IDEA Electronic Components Group

UK . 377 parts In-Stock

1+ parts

$1.158

100+ parts

-

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$1.042

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377

$1.158

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$1.042

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AZTECH Wire

Italy . 374 parts In-Stock

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$10.197

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374

$10.197

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One Stop Electronics

USA . 826 parts In-Stock

1+ parts

$36.050

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826

$36.050

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Semicontronic

India . 1,502 parts In-Stock

1+ parts

$45.050

100+ parts

$43.924

1k+ parts

$43.698

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1,502

$45.050

$43.924

$43.698

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Ampacity Inc.

Singapore . 383 parts In-Stock

1+ parts

$64.050

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383

$64.050

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Corphita

USA . 4,510 parts In-Stock

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4,510

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Corohmni

South Africa . 385 parts In-Stock

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385

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Overview

Elevate your RF amplifier designs with the TGF4212SCMX by Texas Instruments. Manufactured with precision and expertise, this N-CHANNEL RF Power Field Effect Transistor is a game-changer in the industry. Perfect for applications in the Ku Band frequency range, this transistor offers unparalleled performance and reliability. Say goodbye to signal distortion and hello to superior amplification with this surface mount gem. Upgrade your projects with the TGF4212SCMX and experience the difference today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel transistors have better mobility and conductivity compared to P-Channel, making them suitable for high-speed applications like amplifiers in RF systems.

Transistor Application: AMPLIFIER

Being designed specifically for amplification purposes, this transistor is optimized for providing high gain and low noise, making it ideal for RF power applications.

Surface Mount: YES

Surface mount technology allows for easy and reliable PCB assembly, saving space and improving overall system connectivity.

Minimum DS Breakdown Voltage: 10 V

With a breakdown voltage of 10V, this transistor can handle higher voltages without risk of failure, ensuring reliability in various circuit conditions.

Package Shape: RECTANGULAR

Rectangular packages are compact and easy to mount on PCBs, optimizing space utilization and enabling efficient heat dissipation.

Terminal Form: NO LEAD

No-lead terminals reduce parasitic effects and enhance electrical performance, ensuring stable operation in RF amplifier circuits.

Operating Mode: DEPLETION MODE

Depletion mode transistors offer better control over current flow and can be used in amplifier circuits where precise biasing and signal modulation is required.

Highest Frequency Band: KU BAND

Designed for operation in the KU band, this transistor is optimized for high-frequency applications, offering excellent performance in RF systems operating in this frequency range.

No. of Terminals: 4

The presence of 4 terminals allows for versatile connectivity options and enables more complex circuit configurations, ensuring flexibility in RF amplifier design.

Package Style (Meter): UNCASED CHIP

Uncased chip packages provide direct access to the transistor die, allowing for better heat dissipation and improved thermal performance in high-power RF applications.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high input impedance and low input capacitance, making it suitable for high-frequency applications like RF amplifiers.

Transistor Element Material: GALLIUM ARSENIDE

Gallium Arsenide FETs have high electron mobility, enabling high-frequency operation and low noise performance, ideal for RF power applications.

Terminal Position: UPPER

Upper terminal position facilitates easy mounting and connection in PCB layouts, ensuring compatibility with standard RF amplifier circuit designs.

Technical Specifications

RF Power Field Effect Transistors (FET) TGF4212SCMX attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Minimum DS Breakdown Voltage:

10 V

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

KU BAND

JESD-30 Code:

R-XUUC-N4

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Transistor Application:

AMPLIFIER

Transistor Element Material:

GALLIUM ARSENIDE

Trade Compliance

TGF4212SCMX Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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