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TGF4212XCCX

Texas Instruments

TGF4212XCCX by Texas Instruments

TGF4212XCCX by Texas Instruments is an N-CHANNEL RF Power FET for amplifier applications. Operating in DEPLETION MODE, it offers a Min DS Breakdown Voltage of 10V and works in the KU BAND frequency range. This RECTANGULAR chip with GALLIUM ARSENIDE technology has 4 terminals and is surface mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,793 parts In-Stock

1+ parts

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8,793

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Digiode

USA . 3,950 parts In-Stock

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3,950

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,953 parts In-Stock

1+ parts

$0.766

100+ parts

-

1k+ parts

$1.763

10k+ parts

-

1,953

$0.766

-

$1.763

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DigiPath Technology Company

USA . 2,062 parts In-Stock

1+ parts

$0.844

100+ parts

$0.776

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-

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2,062

$0.844

$0.776

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ChromeModa Solutions

Germany . 6,528 parts In-Stock

1+ parts

$0.861

100+ parts

$0.706

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6,528

$0.861

$0.706

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IDEA Electronic Components Group

UK . 2,049 parts In-Stock

1+ parts

$0.861

100+ parts

-

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$0.775

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2,049

$0.861

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$0.775

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$7.056

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254

$7.056

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One Stop Electronics

USA . 280 parts In-Stock

1+ parts

$11.050

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280

$11.050

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Semicontronic

India . 921 parts In-Stock

1+ parts

$36.050

100+ parts

$35.149

1k+ parts

$34.968

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921

$36.050

$35.149

$34.968

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Ampacity Inc.

Singapore . 850 parts In-Stock

1+ parts

$39.050

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850

$39.050

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Corphita

USA . 2,716 parts In-Stock

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2,716

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Corohmni

South Africa . 208 parts In-Stock

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Overview

Boost your RF amplifier performance with the TGF4212XCCX from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality RF Power Field Effect Transistors that are perfect for a wide range of applications in the KU band. With its N-CHANNEL polarity and DEPLETION MODE operating mode, this transistor offers unmatched reliability and efficiency. Say goodbye to signal distortion and hello to enhanced amplification with the TGF4212XCCX - the perfect choice for all your RF power needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically offer higher electron mobility and lower on-resistance, resulting in better performance and efficiency in amplifiers.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplifying signals with minimal distortion.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and facilitating mass production.

Minimum DS Breakdown Voltage: 10 V

With a minimum breakdown voltage of 10 V, this FET offers a high level of protection against voltage spikes, ensuring reliability and longevity.

Package Shape: RECTANGULAR

Rectangular package shape enables easy placement and soldering onto circuit boards, enhancing manufacturability and reliability.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and reduce the risk of contamination during manufacturing processes.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for simple biasing and control, making this FET suitable for various amplifier configurations.

Highest Frequency Band: KU BAND

Designed for operation in the Ku band, this FET is optimized for high-frequency applications such as satellite communications and radar systems.

No. of Terminals: 4

Having 4 terminals allows for easy connection and control of the FET in amplifier circuits, ensuring proper functionality and performance.

Package Style: UNCASED CHIP

Uncased chip package style provides flexibility in mounting options and allows for direct thermal management, enhancing overall performance.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high input impedance and low output impedance, leading to improved stability and performance in amplifier circuits.

Transistor Element Material: GALLIUM ARSENIDE

Gallium arsenide is known for its high electron mobility and high-frequency performance, making this FET ideal for amplifier applications in the Ku band.

Terminal Position: UPPER

The upper terminal position simplifies connection and control of the FET in amplifier circuits, facilitating easy integration and maintenance.

Technical Specifications

RF Power Field Effect Transistors (FET) TGF4212XCCX attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Minimum DS Breakdown Voltage:

10 V

Field Effect Transistor Technology:

JUNCTION

Highest Frequency Band:

KU BAND

JESD-30 Code:

R-XUUC-N4

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Transistor Application:

AMPLIFIER

Transistor Element Material:

GALLIUM ARSENIDE

Trade Compliance

TGF4212XCCX Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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