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AFT05MS031GNR1

NXP Semiconductors

AFT05MS031GNR1 by NXP Semiconductors

N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): 294 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Terminal Finish: TIN;

Median Price

$14.478

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

AFT05MS031GNR1 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 205 parts In-Stock

1+ parts

$14.400

100+ parts

$8.810

1k+ parts

$8.770

10k+ parts

-

205

$14.400

$8.810

$8.770

-

Mouser Electronics

USA . 1,311 parts In-Stock

1+ parts

$33.100

100+ parts

$23.040

1k+ parts

$22.600

10k+ parts

-

1,311

$33.100

$23.040

$22.600

-

DigiKey

USA . 881 parts In-Stock

1+ parts

$38.550

100+ parts

$27.519

1k+ parts

$26.001

10k+ parts

-

881

$38.550

$27.519

$26.001

-

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$14.478

10k+ parts

-

10,000

-

-

$14.478

-

Rochester

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$12.660

1k+ parts

$11.330

10k+ parts

$10.660

450

-

$12.660

$11.330

$10.660

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,104 parts In-Stock

1+ parts

$9.010

100+ parts

-

1k+ parts

-

10k+ parts

-

3,104

$9.010

-

-

-

Digiode

USA . 4,191 parts In-Stock

1+ parts

$13.965

100+ parts

-

1k+ parts

-

10k+ parts

-

4,191

$13.965

-

-

-

Anansix

USA . 1,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,624

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 484 parts In-Stock

1+ parts

$7.660

100+ parts

-

1k+ parts

-

10k+ parts

-

484

$7.660

-

-

-

Corphita

USA . 3,859 parts In-Stock

1+ parts

$13.230

100+ parts

-

1k+ parts

-

10k+ parts

-

3,859

$13.230

-

-

-

Native Components

USA . 487 parts In-Stock

1+ parts

$15.490

100+ parts

-

1k+ parts

-

10k+ parts

-

487

$15.490

-

-

-

Northwest PG Solutions

USA . 2,110 parts In-Stock

1+ parts

$17.039

100+ parts

$15.335

1k+ parts

-

10k+ parts

-

2,110

$17.039

$15.335

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-

UNI Independent Distributors

Spain . 3,937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,937

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-

-

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Technical Specifications

RF Power Field Effect Transistors (FET) AFT05MS031GNR1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

AFT05MS031GNR1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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