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STAC0912-250

STMicroelectronics

STAC0912-250 by STMicroelectronics

STAC0912-250 by STMicroelectronics is an N-channel RF Power FET with 80V DS breakdown voltage. It operates in enhancement mode for L Band applications, featuring a plastic/epoxy package and flat terminals. Ideal for amplifier circuits, this single configuration transistor is surface mountable with a source case connection.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,109 parts In-Stock

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9,109

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Digiode

USA . 4,087 parts In-Stock

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4,087

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Anansix

USA . 1,314 parts In-Stock

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1,314

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,328 parts In-Stock

1+ parts

$1.778

100+ parts

-

1k+ parts

$1.601

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2,328

$1.778

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$1.601

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MKK Technologies

India . 2,044 parts In-Stock

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$3.344

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2,044

$3.344

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DigiPath Technology Company

USA . 2,044 parts In-Stock

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$3.344

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2,044

$3.344

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AZTECH Wire

Italy . 868 parts In-Stock

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$15.510

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868

$15.510

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QUARKTWIN TECHNOLOGY LTD

USA . 3,929 parts In-Stock

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3,929

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Parana Technologies

USA . 1,991 parts In-Stock

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$2.126

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1,991

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$2.126

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Corphita

USA . 1,052 parts In-Stock

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1,052

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Overview

Unlock the power of RF amplification with the STAC0912-250 by STMicroelectronics. This N-CHANNEL FET offers unparalleled performance and reliability, thanks to its cutting-edge technology and superior design. Ideal for applications in the L BAND frequency range, this amplifier transistor is perfect for enhancing signal strength and clarity. With STMicroelectronics' reputation for excellence in semiconductor manufacturing, you can trust that the STAC0912-250 delivers unmatched value and benefits to meet all your RF amplification needs. Elevate your electronic projects with the industry-leading quality and performance of the STAC0912-250 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, ensuring it can withstand various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics such as higher mobility and faster switching speeds compared to P-channel transistors, making them a good choice for amplifier applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and reduces complexity, making it easier to integrate into amplifier systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor provides high gain and low noise performance, making it ideal for amplifying RF signals.

Surface Mount: YES

Surface mount technology allows for easy and compact mounting on PCBs, saving space and enabling efficient manufacturing processes.

Minimum DS Breakdown Voltage: 80 V

With a minimum breakdown voltage of 80 V, this transistor can handle high voltages, providing reliable performance in amplifier applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on PCBs, enhancing the overall layout and design of the amplifier system.

Terminal Form: FLAT

The flat terminal form ensures secure and stable connections, reducing the risk of signal loss or interference in the amplifier circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high transconductance and low on-resistance, resulting in improved efficiency and performance in amplifier applications.

Highest Frequency Band: L BAND

Designed for operation in the L band, this transistor can handle high-frequency signals with stability and minimal loss, making it suitable for RF amplifier applications in this frequency range.

No. of Terminals: 2

The 2-terminal configuration simplifies the connection and integration of the transistor into amplifier circuits, reducing complexity and improving overall efficiency.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides easy and secure mounting options, allowing for reliable installation and operation in amplifier systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low power consumption, and reliability, making this transistor a good choice for RF amplifier applications.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance, low noise, and reliability, making them a preferred choice for amplifier applications requiring stable and efficient operation.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and layout, allowing for easy connection and integration of the transistor in amplifier systems.

Case Connection: SOURCE

The source case connection simplifies the circuit design and layout, ensuring a stable and secure electrical connection for optimized performance in amplifier applications.

Technical Specifications

RF Power Field Effect Transistors (FET) STAC0912-250 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

80 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

STAC0912-250 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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