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PD54008L-E

STMicroelectronics

PD54008L-E by STMicroelectronics

STMicroelectronics PD54008L-E is an N-CHANNEL RF Power FET with 25V DS Breakdown Voltage and 5A Drain Current. Ideal for AMPLIFIER applications in ULTRA HIGH FREQUENCY BAND, it features a 26.7W power dissipation and operates in ENHANCEMENT MODE at up to 150°C.

Median Price

$8.380

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,796 parts In-Stock

1+ parts

$8.380

100+ parts

$5.270

1k+ parts

$5.260

10k+ parts

-

3,796

$8.380

$5.270

$5.260

-

DigiKey

USA . 2,124 parts In-Stock

1+ parts

$8.380

100+ parts

$5.554

1k+ parts

-

10k+ parts

$4.846

2,124

$8.380

$5.554

-

$4.846

Avnet

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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3,000

-

-

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Distributors (In-Stock)

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Nova Conductors

Japan . 83 parts In-Stock

1+ parts

$5.358

100+ parts

-

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-

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83

$5.358

-

-

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Digiode

USA . 4,730 parts In-Stock

1+ parts

$7.961

100+ parts

-

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-

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4,730

$7.961

-

-

-

Chip Stock

USA . 11,500 parts In-Stock

1+ parts

-

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11,500

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Vyrian

USA . 3,491 parts In-Stock

1+ parts

-

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3,491

-

-

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IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

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$6.367

3,000

-

-

-

$6.367

Anansix

USA . 1,080 parts In-Stock

1+ parts

-

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1,080

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LWI Electronics Inc

India . 149 parts In-Stock

1+ parts

-

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149

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 926 parts In-Stock

1+ parts

$0.534

100+ parts

-

1k+ parts

-

10k+ parts

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926

$0.534

-

-

-

Aztec Data Supply Inc.

USA . 874 parts In-Stock

1+ parts

$0.620

100+ parts

-

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874

$0.620

-

-

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IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$0.626

100+ parts

-

1k+ parts

$0.563

10k+ parts

-

883

$0.626

-

$0.563

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$0.907

100+ parts

$0.862

1k+ parts

$0.862

10k+ parts

-

40

$0.907

$0.862

$0.862

-

MKK Technologies

India . 100 parts In-Stock

1+ parts

$1.176

100+ parts

-

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100

$1.176

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DigiPath Technology Company

USA . 100 parts In-Stock

1+ parts

$1.176

100+ parts

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100

$1.176

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-

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Continental Prestige Electronics

USA . 5,931 parts In-Stock

1+ parts

$5.358

100+ parts

-

1k+ parts

-

10k+ parts

$5.250

5,931

$5.358

-

-

$5.250

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.358

100+ parts

-

1k+ parts

$5.090

10k+ parts

$4.982

100

$5.358

-

$5.090

$4.982

Semicontronic

India . 7,522 parts In-Stock

1+ parts

$7.120

100+ parts

$6.942

1k+ parts

$6.906

10k+ parts

-

7,522

$7.120

$6.942

$6.906

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Ampacity Inc.

Singapore . 3,629 parts In-Stock

1+ parts

$7.120

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-

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3,629

$7.120

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Corphita

USA . 4,959 parts In-Stock

1+ parts

$7.542

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4,959

$7.542

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Microchip USA

USA . 305 parts In-Stock

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$15.246

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305

$15.246

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Perfect Parts

USA . 21,287 parts In-Stock

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21,287

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Kepictronics

USA . 17,000 parts In-Stock

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17,000

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iodParts Technologies Inc.

India . 16,610 parts In-Stock

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Lixinc

USA . 9,706 parts In-Stock

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9,706

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RC Electronics

USA . 9,471 parts In-Stock

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9,471

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Argo Parts USA

USA . 313 parts In-Stock

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313

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Parana Technologies

USA . 167 parts In-Stock

1+ parts

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$0.748

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167

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$0.748

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Overview

Experience enhanced performance with the PD54008L-E from STMicroelectronics, a leading manufacturer of RF Power Field Effect Transistors (FET). Ideal for amplifier applications in the ultra-high frequency band, this single N-channel transistor offers a maximum drain current of 5A and a maximum power dissipation of 26.7W. With its innovative metal-oxide semiconductor technology and reliable silicon element material, this transistor ensures optimal functionality and durability. Upgrade your electronic devices with the PD54008L-E and enjoy seamless operation at a competitive price point.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for RF transistors as it provides good insulation and protection for the components inside.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistances and higher electron mobility, making them suitable for high-frequency applications like amplifiers.

Configuration: SINGLE

Single configuration simplifies the circuit design and makes it easier to control the transistor's behavior.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal amplification.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 25 V

A higher breakdown voltage provides better protection against voltage spikes and ensures the longevity of the transistor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making it ideal for RF power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without performance degradation.

Maximum Power Dissipation (Abs): 26.7 W

The high power dissipation rating indicates that this transistor can handle large amounts of power without overheating.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54008L-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

S-PQCC-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54008L-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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