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PD54008S-E-E

STMicroelectronics

PD54008S-E-E by STMicroelectronics

PD54008S-E-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 5 A, a breakdown voltage of 25 V, and operates in the ultra-high frequency band. This compact surface mount transistor ensures efficient performance up to 165 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,440 parts In-Stock

1+ parts

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4,440

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Anansix

USA . 1,750 parts In-Stock

1+ parts

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1,750

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Vyrian

USA . 1,422 parts In-Stock

1+ parts

-

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1,422

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,893 parts In-Stock

1+ parts

$1.680

100+ parts

-

1k+ parts

$1.512

10k+ parts

-

1,893

$1.680

-

$1.512

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MKK Technologies

India . 516 parts In-Stock

1+ parts

$3.159

100+ parts

-

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516

$3.159

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DigiPath Technology Company

USA . 516 parts In-Stock

1+ parts

$3.159

100+ parts

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516

$3.159

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Corphita

USA . 3,025 parts In-Stock

1+ parts

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3,025

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Parana Technologies

USA . 1,389 parts In-Stock

1+ parts

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100+ parts

$2.009

1k+ parts

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1,389

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$2.009

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Overview

Elevate your designs with the PD54008S-E-E from STMicroelectronics, a leading name in semiconductor innovation. This N-channel RF power FET combines exceptional performance with reliability, making it ideal for amplifying applications in ultra-high frequency ranges. With its robust construction and advanced technology, it delivers outstanding efficiency and power handling—perfect for professionals seeking excellence in communication systems. Boost your project’s potential today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their efficiency and better electron mobility, making them ideal for high-speed applications.

Configuration: SINGLE

The single configuration simplifies design and integration into circuits, allowing for easier implementation.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is ideal for audio, RF, and other signal processing applications.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and automated assembly processes, making manufacturing more efficient.

Minimum DS Breakdown Voltage: 25 V

A minimum breakdown voltage of 25V ensures reliability in applications where voltage transients may occur.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space utilization on PCB layouts, enhancing design flexibility.

Terminal Form: FLAT

Flat terminals provide better contact with the PCB and reduce resistive losses, ensuring efficient performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for efficient switching and amplification, making it suitable for modern low-voltage applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra-high frequency band, this FET is perfect for high-frequency communication and signaling.

Maximum Drain Current (Abs) (ID): 5 A

A maximum drain current of 5 A allows for handling substantial loads, making this FET versatile for a range of applications.

No. of Terminals: 2

Having just two terminals simplifies the circuit design and reduces complexity for users.

Maximum Power Dissipation (Abs): 73 W

With the ability to dissipate up to 73 W, this FET can be used in high-power applications without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space, allowing for more compact designs in modern electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high efficiency and low power consumption, making it suitable for a variety of electronic tasks.

Maximum Operating Temperature: 165 °C

A maximum operating temperature of 165 °C allows for reliable performance in high-temperature environments.

Transistor Element Material: SILICON

Silicon as a material provides excellent thermal stability and good electrical characteristics, enhancing overall performance.

Maximum Drain Current (ID): 5 A

Reiterated for emphasis, this high drain current capability signifies robustness in diverse applications.

Terminal Position: DUAL

Dual terminal positioning contributes to ease of integration and circuit design flexibility.

Case Connection: SOURCE

Source connection ensures efficient power management within a circuit, focusing on better performance.

Technical Specifications

RF Power Field Effect Transistors (FET) PD54008S-E-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD54008S-E-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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