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A3G20S350-01SR3

NXP Semiconductors

A3G20S350-01SR3 by NXP Semiconductors

NXP Semiconductors A3G20S350-01SR3 is an N-CHANNEL RF FET with 125V DS Breakdown Voltage, 17dB Power Gain, and GaN Element. Ideal for S Band applications, this DEPLETION MODE transistor operates from -55°C to 225°C in AMPLIFIER circuits.

Median Price

$86.210

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,450 parts In-Stock

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-

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$86.210

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$77.140

10k+ parts

$72.600

2,450

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$86.210

$77.140

$72.600

Distributors (In-Stock)

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Digiode

USA . 1,174 parts In-Stock

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$91.228

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1,174

$91.228

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Nova Conductors

Japan . 26 parts In-Stock

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$95.735

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26

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Vyrian

USA . 3,467 parts In-Stock

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Anansix

USA . 695 parts In-Stock

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695

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VNN

France . 411 parts In-Stock

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411

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Distributors (Availability)

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AZTECH Wire

Italy . 264 parts In-Stock

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$11.900

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264

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Ampacity Inc.

Singapore . 2,386 parts In-Stock

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$81.630

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$81.630

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Corphita

USA . 3,594 parts In-Stock

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$86.427

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3,594

$86.427

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Aranea Global

USA . 1,000 parts In-Stock

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$93.820

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$90.067

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$93.820

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$90.067

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Continental Prestige Electronics

USA . 1,249 parts In-Stock

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$95.735

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$93.820

1,249

$95.735

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$93.820

Microchip USA

USA . 8,615 parts In-Stock

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$204.909

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UNI Independent Distributors

Spain . 5,680 parts In-Stock

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Argo Parts USA

USA . 307 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the A3G20S350-01SR3 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-of-the-line RF Power Field Effect Transistors that are perfect for amplifier applications in the S Band. The ceramic, metal-sealed co-fired package ensures durability while the N-channel configuration provides excellent power gain. Trust NXP to provide you with the quality and value you deserve for all your RF power needs. Elevate your projects with the A3G20S350-01SR3 today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent thermal conductivity and high reliability, making it a durable choice for RF applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher performance, making them ideal for high-frequency applications like amplifiers.

Configuration: SINGLE

Single configuration simplifies circuit design and offers higher efficiency in power amplification.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and signal amplification.

Surface Mount: YES

Surface mount packaging allows for easy installation on PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 125 V

With a minimum breakdown voltage of 125V, this FET can handle higher input voltages and provide increased reliability in operation.

Minimum Power Gain (Gp): 17 dB

A minimum power gain of 17 dB ensures strong amplification capabilities, making it suitable for RF power applications.

Package Shape: RECTANGULAR

Rectangular shape offers efficient use of space and allows for easy integration into circuit designs.

Terminal Form: FLAT

Flat terminals provide a stable connection and facilitate heat dissipation, ensuring reliable operation under high-power conditions.

Operating Mode: DEPLETION MODE

Depletion mode operation allows for easier biasing and control over the FET, improving overall performance in amplification circuits.

Highest Frequency Band: S BAND

Operates in the S band frequency range, making it suitable for a wide range of RF applications in communication systems.

No. of Terminals: 2

With only 2 terminals, this FET offers simple integration into circuit designs and reduces complexity in overall system implementation.

Package Style (Meter): FLATPACK

Flatpack packaging offers a compact and efficient design, saving space in circuit layouts and enabling easier thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Uses MOSFET technology for high-speed switching and low power consumption, making it ideal for RF power applications.

Maximum Operating Temperature: 225 °C

With a maximum operating temperature of 225°C, this FET can withstand high temperatures and maintain stable performance in harsh environments.

Transistor Element Material: GALLIUM NITRIDE

Gallium nitride material offers high electron mobility and improved power handling capabilities, enhancing overall device efficiency and performance.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this FET can operate in extreme temperature conditions, making it suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options and simplifies connection in circuit designs.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds at peak temperature, this FET ensures reliable soldering and consistent performance during assembly processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C guarantees secure solder joints and reliable connections, ensuring long-term operational stability in RF amplification circuits.

Technical Specifications

RF Power Field Effect Transistors (FET) A3G20S350-01SR3 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

125 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-CDFP-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

225 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Minimum Power Gain (Gp):

17 dB

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

GALLIUM NITRIDE

Trade Compliance

A3G20S350-01SR3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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