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BLF246,112

NXP Semiconductors

BLF246,112 by NXP Semiconductors

BLF246,112 by NXP Semiconductors is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage. It operates in the VERY HIGH FREQUENCY BAND and has a max ID of 13A. Ideal for AMPLIFIER applications, this METAL-OXIDE SEMICONDUCTOR FET is designed for ENHANCEMENT MODE operation in a FLANGE MOUNT package.

Median Price

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Lifecycle Status

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5

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1k+

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Anansix

USA . 2,868 parts In-Stock

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Vyrian

USA . 2,580 parts In-Stock

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Digiode

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VNN

France . 918 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 559 parts In-Stock

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One Stop Electronics

USA . 1,213 parts In-Stock

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Ampacity Inc.

Singapore . 1,582 parts In-Stock

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Corphita

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Argo Parts USA

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UNI Independent Distributors

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Experience the power of NXP Semiconductors with the BLF246,112 RF Power Field Effect Transistor. This high-quality component offers unmatched performance and reliability for amplifier applications in the very high-frequency band. With a durable ceramic, metal-sealed package and N-channel configuration, this single transistor boasts a minimum DS breakdown voltage of 65V and a maximum drain current of 13A, ensuring superior functionality. Trust NXP Semiconductors to deliver cutting-edge technology that meets your needs with precision and efficiency. Elevate your projects with the BLF246,112 and experience a new level of quality and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides excellent thermal conductivity and high reliability, ensuring the overall performance and longevity of the RF Power FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-resistance and higher electron mobility, making them suitable for high-frequency applications such as amplifiers.

Configuration: SINGLE

The single configuration simplifies the circuit design and assembly process, making it easier to integrate this FET into various RF amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this RF Power FET delivers high performance and efficiency for signal amplification tasks.

Surface Mount: YES

Being surface mountable, this FET is easy to mount on PCBs, saving space and enhancing overall circuit efficiency.

Minimum DS Breakdown Voltage: 65 V

With a minimum breakdown voltage of 65V, this FET can handle high voltage applications with ease, ensuring reliable performance in demanding conditions.

Package Shape: ROUND

The round package shape allows for easy fitting and installation in various electronic systems, providing flexibility in design and layout.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low ON-state resistance, making them ideal for high-frequency and low power applications like amplifiers.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Designed for very high frequency bands, this RF Power FET delivers superior performance and efficiency in amplifying signals within this frequency range.

No. of Terminals: 4

Having 4 terminals allows for greater flexibility in circuit design and connectivity options, enabling more versatile applications of this FET.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and connection options, ensuring stability and reliability in RF amplifier setups.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency, low power consumption, and fast switching speeds, making this FET ideal for RF amplifier applications.

Maximum Operating Temperature: 200 °C

With a maximum operating temperature of 200°C, this FET can withstand high-temperature environments, ensuring stability and performance in challenging conditions.

Transistor Element Material: SILICON

Silicon-based transistor elements are known for their reliability, efficiency, and high performance, making this RF Power FET a dependable choice for amplifier applications.

Maximum Drain Current (ID): 13 A

With a maximum drain current of 13A, this FET can handle high current loads, making it suitable for power amplification tasks in RF circuits.

Terminal Position: RADIAL

The radial terminal position simplifies the connection process and allows for easy integration into electronic systems, enhancing the overall usability of this FET.

Case Connection: ISOLATED

Isolated case connection helps prevent interference and enhances the reliability of the RF Power FET in amplifier applications, ensuring stable and clean signal amplification.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF246,112 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (ID):

13 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

O-CRFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF246,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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