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BLF147

NXP Semiconductors

BLF147 by NXP Semiconductors

The NXP Semiconductors BLF147 is a single N-channel RF Power FET with a very high frequency band. It has a max drain current of 25A, operating in enhancement mode for amplifier applications. With a package style of flange mount and ceramic-metal-sealed co-fired body material, it offers a max power dissipation of 220W at 200°C ambient temperature.

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RFMW

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Vyrian

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Nova Conductors

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Bristol Electronics

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Corohmni

South Africa . 825 parts In-Stock

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Metaverse IC Inc.

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Glotronic Ltd.

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Perfect Parts

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Corphita

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Continental Prestige Electronics

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Overview

Upgrade your RF amplifier with the BLF147 from NXP Semiconductors, a trusted manufacturer in the industry. This N-channel RF Power Field Effect Transistor offers unparalleled performance and reliability for your amplifier applications. With its very high frequency band and maximum power dissipation of 220W, this transistor is designed to deliver top-notch results. Trust NXP Semiconductors to provide you with quality components that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability, making this RF power FET suitable for rugged environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs, making this RF power FET a good choice for amplifier applications.

Minimum DS Breakdown Voltage: 65 V

With a minimum breakdown voltage of 65V, this FET can withstand higher voltage levels, ensuring stable operation in high-power amplifier circuits.

Maximum Drain Current (ID): 25 A

Capable of handling high drain currents of up to 25A, this RF power FET is ideal for applications requiring high power output.

Maximum Power Dissipation (Abs): 220 W

With a maximum power dissipation of 220W, this FET can effectively dissipate heat generated during operation, ensuring reliable performance under high-power conditions.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation of this FET allows for easier control of the transistor, making it suitable for a wide range of amplifier applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET provides high input impedance and low output impedance, making it an efficient choice for amplification.

Maximum Operating Temperature: 200 °C

With a maximum operating temperature of 200°C, this FET can withstand high-temperature environments, ensuring reliable performance in demanding applications.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF147 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

O-CRFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

220 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF147 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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