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LET20030S

STMicroelectronics

LET20030S by STMicroelectronics

LET20030S by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max power dissipation of 140 W, a breakdown voltage of 65 V, and operates in the L band. This compact device excels in high-frequency performance with enhanced mode operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,801 parts In-Stock

1+ parts

-

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3,801

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Vyrian

USA . 2,607 parts In-Stock

1+ parts

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2,607

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Anansix

USA . 1,181 parts In-Stock

1+ parts

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1,181

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 554 parts In-Stock

1+ parts

$0.557

100+ parts

-

1k+ parts

$0.501

10k+ parts

-

554

$0.557

-

$0.501

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MKK Technologies

India . 600 parts In-Stock

1+ parts

$1.047

100+ parts

-

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600

$1.047

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DigiPath Technology Company

USA . 600 parts In-Stock

1+ parts

$1.047

100+ parts

-

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600

$1.047

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-

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Corphita

USA . 4,270 parts In-Stock

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4,270

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Parana Technologies

USA . 1,070 parts In-Stock

1+ parts

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100+ parts

$0.666

1k+ parts

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1,070

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$0.666

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Overview

Elevate your RF applications with the LET20030S, crafted by industry leader STMicroelectronics. This high-performance N-Channel FET promises exceptional power handling and reliability, ensuring your designs excel in efficiency and durability. Ideal for amplifiers, its compact surface mount package fits seamlessly into modern electronics. Experience unmatched quality and support from a trusted manufacturer, empowering your projects with innovation and performance that stands out.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides robust protection against environmental factors, making the device durable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher efficiency and faster switching speeds, making this transistor suitable for high-performance applications.

Configuration: SINGLE

A single configuration simplifies design and integration, making it easier to implement in amplifier circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this FET ensures high signal integrity and fidelity.

Surface Mount: YES

Surface mount technology allows for compact designs and easier production processes, leading to reduced PCB space requirements.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65 V indicates reliable operation in high-voltage applications, enhancing the device’s versatility.

Package Shape: RECTANGULAR

The rectangular shape of the package facilitates easier placement on PCBs, optimizing space and layout.

Terminal Form: FLAT

Flat terminals improve surface contact and heat dissipation, which is critical for maintaining performance under high power conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation typically leads to lower power consumption in off-state, which improves overall energy efficiency.

Highest Frequency Band: L BAND

Capability to operate in the L band makes this FET suitable for communications and broadcasting applications that require stable performance.

No. of Terminals: 2

Having only 2 terminals simplifies the design and integration process, making it easier for engineers to work with.

Maximum Power Dissipation (Abs): 140 W

With a high power dissipation rating of 140 W, this FET can handle substantial power loads, useful for demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, making it a preferred choice for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low power consumption, contributing to efficient and reliable operation.

Maximum Operating Temperature: 165 °C

A high operating temperature indicates robustness and reliability in extreme environments, making it suitable for demanding applications.

Transistor Element Material: SILICON

Silicon is a well-established material for semiconductors, providing a good balance between performance, cost, and availability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout configurations, optimizing design flexibilities in various applications.

Case Connection: SOURCE

The source connection in the case aids in heat management and ease of connection, improving reliability in performance.

Technical Specifications

RF Power Field Effect Transistors (FET) LET20030S attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET20030S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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