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SD2923

STMicroelectronics

SD2923 by STMicroelectronics

SD2923 by STMicroelectronics is an N-channel RF power FET designed for ultra-high frequency applications. It features a max drain current of 40 A, a breakdown voltage of 125 V, and can dissipate up to 648 W. Ideal for high-performance RF amplification in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,605 parts In-Stock

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4,605

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Digiode

USA . 742 parts In-Stock

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742

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Anansix

USA . 707 parts In-Stock

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707

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 485 parts In-Stock

1+ parts

$1.453

100+ parts

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$1.307

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485

$1.453

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$1.307

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MKK Technologies

India . 615 parts In-Stock

1+ parts

$2.732

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615

$2.732

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DigiPath Technology Company

USA . 615 parts In-Stock

1+ parts

$2.732

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615

$2.732

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Parana Technologies

USA . 2,265 parts In-Stock

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$1.737

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2,265

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$1.737

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Corphita

USA . 1,525 parts In-Stock

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1,525

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Overview

Unlock the power of superior RF performance with the SD2923 from STMicroelectronics. Renowned for its reliability and cutting-edge technology, this N-channel FET offers exceptional efficiency in ultra-high frequency applications. Built to withstand extreme conditions, it ensures optimal functionality while minimizing energy loss. Choose the SD2923 for unmatched quality, remarkable durability, and innovative solutions that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, which enhances the reliability of the FET.

Polarity or Channel Type: N-CHANNEL

An N-channel configuration allows for higher electron mobility, making it suitable for efficient power amplification applications.

Configuration: SINGLE

The single configuration simplifies circuit design and integration, ensuring ease of use in various applications.

Minimum DS Breakdown Voltage: 125 V

A minimum breakdown voltage of 125 V allows the FET to operate reliably under high-voltage conditions, making it suitable for robust applications.

Package Shape: ROUND

The round package shape is conducive to space-efficient designs and can easily fit into various mounting environments.

Terminal Form: FLAT

Flat terminals provide a solid connection to the circuit, enhancing the performance and reliability of the FET in high-power applications.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for greater control over the drain current, leading to effective switching and amplification.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of operating in the ultra high frequency band, this FET is ideal for advanced communication systems and high-frequency applications.

Maximum Drain Current (Abs) (ID): 40 A

Handling a maximum drain current of 40 A allows the transistor to be used in high-power settings, ensuring it meets demanding operational requirements.

No. of Terminals: 4

With 4 terminals, this FET offers flexibility in circuit configurations and can cater to various electronic design requirements.

Maximum Power Dissipation (Abs): 648 W

A high maximum power dissipation of 648 W enables the FET to manage significant power loads without overheating, making it suitable for heavy-duty applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides ease of installation and stability in mounting, essential for maintaining performance under operating conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOS technology results in lower power consumption and higher efficiency, crucial for modern electronic applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET is capable of functioning in high-temperature environments, enhancing its versatility.

Transistor Element Material: SILICON

Silicon as the transistor element material offers excellent electrical properties and is cost-effective for large-scale production.

Maximum Drain Current (ID): 40 A

The ability to manage a maximum drain current of 40 A ensures robustness in high-load applications, providing reliability and performance.

Terminal Position: RADIAL

Radial terminal positioning optimizes space within circuit designs, facilitating easier integration into compact electronic systems.

Case Connection: SOURCE

A source case connection allows for effective grounding and stability in operation, improving overall performance in circuit applications.

Technical Specifications

RF Power Field Effect Transistors (FET) SD2923 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

125 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

O-PRFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

FLAT

Terminal Position:

RADIAL

Transistor Element Material:

SILICON

Trade Compliance

SD2923 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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