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PD55008L-E

STMicroelectronics

PD55008L-E by STMicroelectronics

STMicroelectronics' PD55008L-E is an N-CHANNEL RF Power FET with 40V DS Breakdown Voltage, ideal for AMPLIFIER applications. Operating in ENHANCEMENT MODE at ULTRA HIGH FREQUENCY, it offers 5A Drain Current and 19.5W Power Dissipation in a SQUARE PLASTIC package with NO LEAD terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,877 parts In-Stock

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6,877

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Digiode

USA . 2,451 parts In-Stock

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2,451

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Anansix

USA . 1,096 parts In-Stock

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1,096

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Nova Conductors

Japan . 32 parts In-Stock

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32

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 679 parts In-Stock

1+ parts

$0.989

100+ parts

-

1k+ parts

$0.890

10k+ parts

-

679

$0.989

-

$0.890

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Modulus Dynamics

Lithuania . 200 parts In-Stock

1+ parts

$1.357

100+ parts

$1.357

1k+ parts

$1.357

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-

200

$1.357

$1.357

$1.357

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MKK Technologies

India . 2,200 parts In-Stock

1+ parts

$1.860

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2,200

$1.860

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DigiPath Technology Company

USA . 2,200 parts In-Stock

1+ parts

$1.860

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2,200

$1.860

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$1.890

100+ parts

$1.720

1k+ parts

$1.550

10k+ parts

-

2,000

$1.890

$1.720

$1.550

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Semicontronic

India . 836 parts In-Stock

1+ parts

$6.050

100+ parts

$5.899

1k+ parts

$5.868

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836

$6.050

$5.899

$5.868

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AZTECH Wire

Italy . 756 parts In-Stock

1+ parts

$12.251

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756

$12.251

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Ampacity Inc.

Singapore . 193 parts In-Stock

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$42.050

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193

$42.050

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Lixinc

USA . 15,714 parts In-Stock

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Perfect Parts

USA . 11,151 parts In-Stock

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Argo Parts USA

USA . 4,165 parts In-Stock

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Assy Fe

Spain . 2,956 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 2,233 parts In-Stock

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2,233

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Parana Technologies

USA . 1,467 parts In-Stock

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$1.182

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1,467

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$1.182

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Continental Prestige Electronics

USA . 1,341 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Kepictronics

USA . 122 parts In-Stock

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122

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Overview

Transform your RF amplifier applications with the PD55008L-E by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL FET offers unparalleled quality and performance in the ultra-high frequency band. With a maximum power dissipation of 19.5W and a minimum DS breakdown voltage of 40V, this enhancement mode transistor is designed to exceed your expectations. Whether you're looking for reliability, efficiency, or innovation, the PD55008L-E delivers it all. Elevate your projects and unlock endless possibilities with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that provides protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and high performance in amplifying applications.

Configuration: SINGLE

Simplified design with only one channel, making it easy to integrate into circuits.

Transistor Application: AMPLIFIER

Specifically designed for amplification tasks, ensuring excellent performance in signal processing.

Surface Mount: YES

Easy to mount on circuit boards for streamlined manufacturing and assembly processes.

Minimum DS Breakdown Voltage: 40 V

Can withstand high voltages, providing reliability and stability in operation.

Maximum Drain Current (Abs) (ID): 5 A

Capable of handling high current levels, making it suitable for power applications.

Maximum Power Dissipation (Abs): 19.5 W

Efficient power dissipation to prevent overheating and ensure long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Advanced technology for improved performance and efficiency in signal amplification.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without compromising performance.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55008L-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

S-PQCC-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55008L-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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