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BLF6G27S-45

NXP Semiconductors

BLF6G27S-45 by NXP Semiconductors

The NXP Semiconductors BLF6G27S-45 is an RF Power FET with a 65V DS breakdown voltage and 20A drain current. It operates in enhancement mode, suitable for S band applications like amplifiers. The package is ceramic-metal sealed co-fired, flatpack style with dual terminals and a max temperature of 150°C.

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VNN

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Nova Conductors

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Prism Electronics

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AZTECH Wire

Italy . 651 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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A-Z Elektronik GmbH

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Overview

Unleash the power of cutting-edge RF technology with the BLF6G27S-45 from NXP Semiconductors. Designed for high-performance applications, this N-CHANNEL amplifier transistor offers unparalleled reliability and efficiency. Whether you're looking to boost signal strength or enhance communication systems, this product delivers exceptional results. With a durable ceramic, metal-sealed cofired package and an operating temperature of 150°C, the BLF6G27S-45 is built to withstand even the most demanding environments. Trust NXP Semiconductors to provide top-of-the-line solutions for all your RF power needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed co-fired package body material provides durability and reliability, making this product suitable for rugged environments.

Polarity or Channel Type: N-CHANNEL

N-channel type offers high electron mobility and low on-resistance, resulting in better performance and efficiency.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and output power.

Minimum DS Breakdown Voltage: 65 V

With a minimum breakdown voltage of 65V, this product can handle high voltage inputs without compromising performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Drain Current (Abs) (ID): 20 A

With a maximum drain current of 20A, this RF power FET can handle high power levels effectively, making it suitable for demanding applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this product can withstand high temperatures, ensuring reliable performance in various conditions.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF6G27S-45 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-CDFP-F2

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF6G27S-45 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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