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BLF6G27S-45,112

NXP Semiconductors

BLF6G27S-45,112 by NXP Semiconductors

NXP Semiconductors' BLF6G27S-45,112 is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage. It operates in S BAND with 20A Drain Current for AMPLIFIER applications. The METAL-OXIDE SEMICONDUCTOR technology and ENHANCEMENT MODE make it suitable for high-frequency amplification needs.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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VNN

France . 1,874 parts In-Stock

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Digiode

USA . 1,860 parts In-Stock

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Anansix

USA . 1,237 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 750 parts In-Stock

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Bristol Electronics

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AZTECH Wire

Italy . 477 parts In-Stock

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One Stop Electronics

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$27.050

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Ampacity Inc.

Singapore . 1,600 parts In-Stock

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UNI Independent Distributors

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QUARKTWIN TECHNOLOGY LTD

USA . 6,497 parts In-Stock

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Argo Parts USA

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Corphita

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Unlock the potential of your RF power applications with the BLF6G27S-45,112 by NXP Semiconductors. This high-quality FET offers unparalleled performance and reliability, making it the perfect choice for amplifier designs in the S band. With a maximum drain current of 20 A and a minimum DS breakdown voltage of 65 V, this N-channel transistor is a game-changer in the field. Trust NXP Semiconductors to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the BLF6G27S-45,112 and experience a new level of efficiency and power.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package material provides excellent heat dissipation and durability, making it a reliable choice for high-power applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making this product ideal for amplification purposes.

Configuration: SINGLE

Single configuration FETs are simpler to design and implement, offering a cost-effective solution for amplifier circuits.

Transistor Application: AMPLIFIER

Specifically designed for amplification, this FET is optimized for signal boosting applications.

Surface Mount: YES

Surface-mount compatibility allows for easy and efficient PCB assembly, saving space and reducing overall system size.

Minimum DS Breakdown Voltage: 65 V

With a high breakdown voltage, this FET can handle large voltage spikes and maintain stable operation in high-power environments.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact footprint, making it suitable for applications with limited space.

Terminal Form: FLAT

Flat terminals offer easy soldering and secure connection, enhancing the reliability of the device during operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easy to control and offer high gain, making them ideal for amplifier circuits.

Highest Frequency Band: S BAND

Designed for operation in the S band frequency range, this FET is suitable for high-frequency applications such as radar systems.

Maximum Drain Current (Abs) (ID): 20 A

With a high drain current rating, this FET can handle large current loads without overheating or performance degradation.

No. of Terminals: 2

The two-terminal configuration simplifies circuit design and reduces complexity, making it a convenient choice for amplifier applications.

Package Style (Meter): FLATPACK

The flatpack package style offers easy mounting and installation, enhancing the overall usability of the FET in amplifier circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high reliability and efficiency, ensuring long-term performance in amplifier applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand harsh environmental conditions without compromising performance.

Transistor Element Material: SILICON

Silicon material offers excellent thermal conductivity and durability, ensuring stable operation and long lifespan for the FET.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and layout, allowing for versatile integration into amplifier systems.

Case Connection: SOURCE

The source connection simplifies circuit design and enhances signal integrity, making it an efficient choice for amplifier applications.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF6G27S-45,112 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-CDFP-F2

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF6G27S-45,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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