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SD57060

STMicroelectronics

SD57060 by STMicroelectronics

SD57060 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 7 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. Its compact flange mount design ensures efficient performance in various electronic devices.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 2,448 parts In-Stock

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Digiode

USA . 276 parts In-Stock

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Anansix

USA . 203 parts In-Stock

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Standard Data Resources

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Electronics Depot

USA . 3 parts In-Stock

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IDEA Electronic Components Group

UK . 1,295 parts In-Stock

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$0.747

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$0.672

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1,295

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MKK Technologies

India . 1,498 parts In-Stock

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$1.405

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DigiPath Technology Company

USA . 1,498 parts In-Stock

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$1.405

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$1.405

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AZTECH Wire

Italy . 437 parts In-Stock

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$15.620

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Corphita

USA . 1,693 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,196 parts In-Stock

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Parana Technologies

USA . 936 parts In-Stock

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$0.893

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Perfect Parts

USA . 62 parts In-Stock

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Overview

Unlock unparalleled performance with the SD57060 from STMicroelectronics, a leader in innovative semiconductor solutions. This robust N-channel RF Power FET delivers exceptional amplification for ultra-high frequency applications, ensuring reliability and efficiency in demanding environments. With its durable plastic/epoxy package and a high operating temperature tolerance, it stands out in quality and versatility, empowering your projects with superior signal integrity and power management. Choose SD57060 for excellence that elevates your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides excellent protection against environmental factors, ensuring durability and reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer lower on-state resistance, higher efficiency, and faster switching speeds, making them well-suited for RF applications.

Configuration: SINGLE

A single configuration simplifies design and integration into circuit boards, making it easier to use in various electronic designs.

Transistor Application: AMPLIFIER

Designed for amplifying signals, this FET is ideal for RF amplification, ensuring high performance in communication systems.

Surface Mount: YES

Surface mount technology contributes to compact designs, allowing for increased density and reduced overall PCB size.

Minimum DS Breakdown Voltage: 65 V

A minimum breakdown voltage of 65 V ensures reliability in high-voltage applications, preventing potential failure during operation.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for space efficiency and compatibility with various PCB layouts.

Terminal Form: FLAT

Flat terminal designs facilitate easy soldering and enhance thermal performance, improving the reliability of thermal management.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency as the transistor is in an off state until activated, making it ideal for low-power applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operation in the ultra-high frequency band makes this FET suitable for applications such as RF communications, ensuring high-frequency performance.

Maximum Drain Current (Abs) (ID): 7 A

With a maximum drain current of 7 A, this FET is capable of handling demanding applications while maintaining performance integrity.

No. of Terminals: 2

Having only 2 terminals simplifies circuit design and reduces potential points of failure, contributing to overall reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers secure mounting options, improving stability within the system and facilitating heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances switching speed and power efficiency, making this product effective for various RF applications.

Maximum Operating Temperature: 200 Cels

A high operating temperature rating ensures functionality in extreme environments, making it versatile for various applications.

Transistor Element Material: SILICON

Silicon offers well-established performance characteristics in transistors, ensuring reliability and efficiency.

Maximum Drain Current (ID): 7 A

Reiterating the maximum drain current capability confirms its robustness in handling diverse loads across applications.

Terminal Position: DUAL

Dual terminal positioning allows for better placement flexibility on PCBs, enhancing design convenience.

Case Connection: SOURCE

Connecting to the source provides straightforward implementation in circuits and improves overall circuit performance.

Technical Specifications

RF Power Field Effect Transistors (FET) SD57060 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD57060 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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