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AFT09S200W02SR3

NXP Semiconductors

AFT09S200W02SR3 by NXP Semiconductors

RF Power Field-Effect Transistors; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

AFT09S200W02SR3 by NXP Semiconductors
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Vyrian

USA . 4,462 parts In-Stock

1+ parts

-

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1k+ parts

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4,462

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Digiode

USA . 2,221 parts In-Stock

1+ parts

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2,221

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Anansix

USA . 1,733 parts In-Stock

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1,733

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Distributors (Availability)

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Native Components

USA . 935 parts In-Stock

1+ parts

$0.318

100+ parts

-

1k+ parts

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10k+ parts

$0.305

935

$0.318

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-

$0.305

Northwest PG Solutions

USA . 544 parts In-Stock

1+ parts

$0.350

100+ parts

-

1k+ parts

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10k+ parts

$0.308

544

$0.350

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-

$0.308

One Stop Electronics

USA . 1,829 parts In-Stock

1+ parts

$57.050

100+ parts

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1,829

$57.050

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UNI Independent Distributors

Spain . 3,455 parts In-Stock

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3,455

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Corphita

USA . 663 parts In-Stock

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663

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Microchip USA

USA . 279 parts In-Stock

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279

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Technical Specifications

RF Power Field Effect Transistors (FET) AFT09S200W02SR3 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Peak Reflow Temperature (C):

260

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

AFT09S200W02SR3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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