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CLF1G0060S-10

NXP Semiconductors

CLF1G0060S-10 by NXP Semiconductors

NXP Semiconductors' CLF1G0060S-10 is an N-CHANNEL RF Power FET with 150V DS Breakdown Voltage. It operates in DEPLETION MODE for C BAND applications, featuring GALLIUM NITRIDE technology and a max temp of 250 °C. Ideal for AMPLIFIER circuits, it comes in a METAL-SEALED COFIRED CERAMIC package.

Median Price

$84.750

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Rochester

USA . 294 parts In-Stock

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$84.750

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$75.830

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$71.370

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Digiode

USA . 2,082 parts In-Stock

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$89.680

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Vyrian

USA . 4,714 parts In-Stock

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Anansix

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Distributors (Availability)

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Corphita

USA . 1,621 parts In-Stock

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$84.960

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Microchip USA

USA . 2,869 parts In-Stock

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$154.120

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$150.010

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$147.950

10k+ parts

$145.900

2,869

$154.120

$150.010

$147.950

$145.900

QUARKTWIN TECHNOLOGY LTD

USA . 12,048 parts In-Stock

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UNI Independent Distributors

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Northwest PG Solutions

USA . 1,055 parts In-Stock

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Native Components

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Overview

Unleash the power of cutting-edge technology with the CLF1G0060S-10 by NXP Semiconductors. This RF Power Field Effect Transistor offers unparalleled performance and reliability, making it the perfect choice for a wide range of amplifier applications. With its high electron mobility technology and gallium nitride element material, this transistor ensures superior quality and efficiency. Experience seamless integration with its surface mount capability and flatpack package style, while enjoying the benefits of its 150V minimum DS breakdown voltage and operating temperature of up to 250°C. Elevate your projects to new heights with the CLF1G0060S-10 and revolutionize the way you amplify signals.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material ensures high durability and reliability, making this FET suitable for rugged outdoor applications.

Polarity or Channel Type: N-CHANNEL

The N-channel type allows for efficient flow of electron carriers, resulting in better performance and lower conduction losses.

Configuration: SINGLE

The single configuration simplifies circuit design and offers ease of integration, making it ideal for applications where space is limited.

Transistor Application: AMPLIFIER

Designed specifically for amplification purposes, this FET delivers high power output and excellent signal amplification capabilities.

Surface Mount: YES

Being surface mountable, this FET can be easily mounted on circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 150 V

The minimum breakdown voltage of 150 V ensures reliable operation even under high voltage conditions, making it suitable for power applications.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient heat dissipation and easy mounting options, enhancing the overall performance and reliability of the FET.

Terminal Form: FLAT

The flat terminal form allows for easy soldering and connection, ensuring secure electrical connections and improving overall reliability.

Operating Mode: DEPLETION MODE

Operating in depletion mode offers better control over the flow of current, enabling precise amplification and signal processing.

Highest Frequency Band: C BAND

Designed for high-frequency applications in the C band range, this FET enables efficient signal processing and amplification in communication systems.

No. of Terminals: 2

With only 2 terminals, this FET simplifies circuit design and reduces complexity, making it ideal for applications with limited space and components.

Package Style (Meter): FLATPACK

The flatpack package style offers compact size, easy integration, and efficient heat dissipation, making it suitable for space-constrained applications.

Field Effect Transistor Technology: HIGH ELECTRON MOBILITY

Utilizing high electron mobility technology, this FET delivers superior performance and efficiency in high-frequency applications, making it an excellent choice for RF power amplifiers.

Maximum Operating Temperature: 250 °C

With a maximum operating temperature of 250°C, this FET can withstand high temperature environments, making it suitable for industrial and automotive applications.

Transistor Element Material: GALLIUM NITRIDE

Made from gallium nitride, this FET offers high electron mobility and superior power handling capabilities, making it ideal for high-power RF applications.

Terminal Position: DUAL

Having dual terminal positions allows for flexible mounting and connection options, enabling easier integration into various circuit configurations.

Case Connection: SOURCE

The source case connection ensures efficient heat dissipation and reliable grounding, enhancing overall performance and longevity of the FET.

Reference Standard: IEC-60134

Compliance with the IEC-60134 standard ensures quality and reliability, making this FET a trusted choice for RF power amplification applications.

Technical Specifications

RF Power Field Effect Transistors (FET) CLF1G0060S-10 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

150 V

Field Effect Transistor Technology:

HIGH ELECTRON MOBILITY

Highest Frequency Band:

C BAND

JESD-30 Code:

R-CDFP-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

250 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Polarity or Channel Type:

Reference Standard:

IEC-60134

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

GALLIUM NITRIDE

Trade Compliance

CLF1G0060S-10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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