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PD55035

STMicroelectronics

PD55035 by STMicroelectronics

PD55035 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 8.5 A, a breakdown voltage of 40 V, and operates in the ultra-high frequency band. This compact surface mount device ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,075 parts In-Stock

1+ parts

-

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1k+ parts

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3,075

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Vyrian

USA . 1,695 parts In-Stock

1+ parts

-

100+ parts

-

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1,695

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-

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Anansix

USA . 1,472 parts In-Stock

1+ parts

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10k+ parts

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1,472

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,572 parts In-Stock

1+ parts

$1.345

100+ parts

-

1k+ parts

$1.211

10k+ parts

-

1,572

$1.345

-

$1.211

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MKK Technologies

India . 1,973 parts In-Stock

1+ parts

$2.529

100+ parts

-

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-

10k+ parts

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1,973

$2.529

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DigiPath Technology Company

USA . 1,973 parts In-Stock

1+ parts

$2.529

100+ parts

-

1k+ parts

-

10k+ parts

-

1,973

$2.529

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-

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Corphita

USA . 3,715 parts In-Stock

1+ parts

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3,715

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Parana Technologies

USA . 1,714 parts In-Stock

1+ parts

-

100+ parts

$1.608

1k+ parts

-

10k+ parts

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1,714

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$1.608

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Overview

Unlock the power of performance with the PD55035 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel RF Power FET excels in amplifier applications, delivering robust efficiency and reliability for ultra-high frequency operations. Housed in a compact, surface-mount design, it offers exceptional thermal management and high drain current capabilities. Experience unmatched quality and transformative value that empower your projects to thrive in any demanding environment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide higher efficiency and lower on-resistance, making them ideal for power applications.

Configuration: SINGLE

A single configuration simplifies circuit design and integration into various applications.

Transistor Application: AMPLIFIER

Optimized for amplifier applications, this FET can effectively amplify signals with minimal distortion.

Surface Mount: YES

Surface mount technology allows for simpler assembly and better performance in compact designs.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40V ensures reliable performance in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration and mounting on printed circuit boards (PCBs).

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical stability during operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows low power consumption and improved efficiency, particularly in amplifiers.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

The capability to operate in the ultra high frequency band makes this FET suitable for advanced communication applications.

Maximum Drain Current (Abs) (ID): 8.5 A

A maximum drain current rating of 8.5A supports high-power applications without compromising performance.

No. of Terminals: 2

Having only 2 terminals simplifies circuitry, reducing assembly complexity and potential points of failure.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for tight spaces, allowing for more compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching speeds, which are essential for modern electronics.

Maximum Operating Temperature: 165 °C

Operating at high temperatures of up to 165 °C increases reliability in harsh environments.

Transistor Element Material: SILICON

Silicon transistors provide excellent thermal stability and efficiency, ensuring consistent performance.

Terminal Finish: TIN LEAD

Tin-lead finish enhances solderability and ensures long-lasting connections in electronic assemblies.

Maximum Drain Current (ID): 7 A

Rated for 7A drain current, this component can handle substantial power loads efficiently.

Terminal Position: DUAL

Dual terminal positioning allows for versatile circuit design and improved layout options.

Case Connection: SOURCE

Source case connection enables easy integration into circuits while maximizing thermal performance.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55035 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

8.5 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55035 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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