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BLF861

NXP Semiconductors

BLF861 by NXP Semiconductors

BLF861 by NXP is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage, ideal for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND. It features COMMON SOURCE configuration, 18A ID, and METAL-OXIDE SEMICONDUCTOR technology in a CERAMIC package with FLANGE MOUNT style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,887 parts In-Stock

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Anansix

USA . 1,135 parts In-Stock

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VNN

France . 1,040 parts In-Stock

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Vyrian

USA . 834 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Ampacity Inc.

Singapore . 215 parts In-Stock

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$10.050

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AZTECH Wire

Italy . 722 parts In-Stock

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One Stop Electronics

USA . 1,228 parts In-Stock

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$18.050

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$18.050

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Semicontronic

India . 267 parts In-Stock

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$31.050

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$30.274

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$30.118

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Continental Prestige Electronics

USA . 4,306 parts In-Stock

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Argo Parts USA

USA . 1,834 parts In-Stock

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Corphita

USA . 932 parts In-Stock

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UNI Independent Distributors

Spain . 452 parts In-Stock

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Kepictronics

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unleash the power of innovation with the BLF861 by NXP Semiconductors. As a leader in RF Power Field Effect Transistors, NXP delivers top-notch quality and reliability in every product. The BLF861 offers unmatched performance in amplifier applications, with a common source configuration and two elements for optimal functionality. With a maximum drain current of 18A and operating in the ultra-high frequency band, this transistor is a game-changer in the industry. Trust NXP for cutting-edge technology that exceeds expectations and propels your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and heat dissipation, making the product suitable for high power applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors are known for their high efficiency and fast switching speeds, making them ideal for amplifier applications.

Minimum DS Breakdown Voltage: 65 V

The high breakdown voltage ensures the transistor can handle high voltage levels without damage, increasing reliability and safety.

Surface Mount: YES

Surface-mount technology simplifies PCB assembly, reduces footprint, and improves overall system efficiency.

Maximum Drain Current (ID): 18 A

With a high maximum drain current rating, this transistor can handle high power loads effectively.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF861 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (ID):

18 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF861 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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