Loading...

BLF3G21-30,112

NXP Semiconductors

BLF3G21-30,112 by NXP Semiconductors

NXP Semiconductors' BLF3G21-30,112 is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage. Ideal for AMPLIFIER applications in the ULTRA HIGH FREQUENCY BAND, it features a max Drain Current of 4.5A and operates in ENHANCEMENT MODE at up to 200°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,596 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,596

-

-

-

-

VNN

France . 2,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,038

-

-

-

-

Vyrian

USA . 253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

253

-

-

-

-

Anansix

USA . 108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

108

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$16.541

100+ parts

-

1k+ parts

-

10k+ parts

-

253

$16.541

-

-

-

Ampacity Inc.

Singapore . 903 parts In-Stock

1+ parts

$39.050

100+ parts

-

1k+ parts

-

10k+ parts

-

903

$39.050

-

-

-

One Stop Electronics

USA . 1,463 parts In-Stock

1+ parts

$61.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,463

$61.050

-

-

-

Component Stockers USA

USA . 397 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$99.990

-

-

-

Corphita

USA . 4,909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,909

-

-

-

-

Argo Parts USA

USA . 4,863 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,863

-

-

-

-

UNI Independent Distributors

Spain . 4,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,549

-

-

-

-

Continental Prestige Electronics

USA . 108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

108

-

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the BLF3G21-30,112 by NXP Semiconductors. This RF Power Field Effect Transistor offers unparalleled performance and reliability, making it the go-to choice for amplifier applications in the ultra-high frequency band. With a ceramic, metal-sealed cofired package and an enhancement mode configuration, this transistor ensures top-notch quality and efficiency. Elevate your projects to new heights with the BLF3G21-30,112 and experience the difference that superior craftsmanship can make.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent heat dissipation and durability, making the transistor suitable for high-power applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance characteristics compared to P-Channel FETs, making this transistor a good choice for amplifier applications.

Minimum DS Breakdown Voltage: 65 V

With a high breakdown voltage, this transistor can handle higher voltage applications with ease.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easier to use and provide better control over the amplification process.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low on-state resistance and high switching speeds, making this transistor efficient for amplifier applications.

Maximum Operating Temperature: 200 °C

With a high operating temperature, this transistor can withstand demanding environments without compromising performance.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF3G21-30,112 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF3G21-30,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 14