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BLF369

NXP Semiconductors

BLF369 by NXP Semiconductors

The NXP Semiconductors BLF369 is an RF Power FET commonly used as an amplifier in the ultra high frequency band. With a min DS breakdown voltage of 65V and operating mode in enhancement mode, it offers reliable performance. Its ceramic, metal-sealed co-fired package body material ensures durability.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Digiode

USA . 4,038 parts In-Stock

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VNN

France . 2,479 parts In-Stock

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Vyrian

USA . 1,019 parts In-Stock

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Anansix

USA . 434 parts In-Stock

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Nova Conductors

Japan . 79 parts In-Stock

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Ampacity Inc.

Singapore . 197 parts In-Stock

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$2.050

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AZTECH Wire

Italy . 401 parts In-Stock

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One Stop Electronics

USA . 1,531 parts In-Stock

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$48.050

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Lixinc

USA . 7,935 parts In-Stock

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Corphita

USA . 4,999 parts In-Stock

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UNI Independent Distributors

Spain . 869 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Discover the BLF369 by NXP Semiconductors, a cutting-edge RF Power Field Effect Transistor (FET) that guarantees unmatched quality and performance. Manufactured by industry leader NXP Semiconductors, this product is designed to amplify signals with precision and efficiency. With its common source configuration and dual terminal position, it offers customers an ideal solution for various amplifier applications. The BLF369's advanced technology and maximum operating temperature of 200 °C ensure exceptional reliability and durability. Experience unparalleled value and benefits with the BLF369, your ultimate choice for enhanced signal amplification in the ultra-high frequency band.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired body material provides excellent durability and reliability, ensuring a long lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-Channel configuration offers high electron mobility and faster switching speeds, making it suitable for high-frequency applications.

Configuration: COMMON SOURCE, 2 ELEMENTS

Common source configuration allows for easy integration into amplifier circuits, and the presence of 2 elements enhances the overall power output.

Transistor Application: AMPLIFIER

Designed specifically for use in amplifier circuits, ensuring optimal performance and efficiency.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 65 V

With a minimum breakdown voltage of 65V, this transistor can handle high power levels without risking damage.

Package Shape: RECTANGULAR

The rectangular shape provides a convenient form factor for easy mounting and integration into electronic systems.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers improved control over the transistor's output, leading to better performance in amplification applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for operation in the ultra-high frequency band, making it ideal for applications that require high-speed signal processing.

No. of Elements: 2

Presence of 2 elements enhances the power output and performance of the transistor.

No. of Terminals: 4

4 terminals provide increased connectivity options and flexibility in circuit design.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for secure and stable mounting in electronic systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in signal amplification applications.

Maximum Operating Temperature: 200 °C

With a maximum operating temperature of 200 °C, this transistor can withstand high-temperature environments without compromising performance.

Transistor Element Material: SILICON

Silicon material provides excellent conductivity and reliability, ensuring long-term performance in amplifier circuits.

Terminal Position: DUAL

Dual terminal position allows for easy installation and connectivity in electronic systems.

Case Connection: SOURCE

Source case connection provides a common ground reference for improved stability in amplifier circuits.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF369 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF369 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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