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BLF369,112

NXP Semiconductors

BLF369,112 by NXP Semiconductors

The NXP Semiconductors BLF369,112 is an N-CHANNEL RF Power FET with a 65V DS Breakdown Voltage. It operates in the Ultra High Frequency Band and has a max temperature of 200°C. Commonly used as an amplifier in applications requiring high-frequency signal amplification.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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VNN

France . 5,682 parts In-Stock

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Digiode

USA . 1,981 parts In-Stock

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Anansix

USA . 1,681 parts In-Stock

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Vyrian

USA . 1,001 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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AZTECH Wire

Italy . 525 parts In-Stock

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$13.387

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Ampacity Inc.

Singapore . 1,470 parts In-Stock

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$39.050

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One Stop Electronics

USA . 1,580 parts In-Stock

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$47.050

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UNI Independent Distributors

Spain . 4,109 parts In-Stock

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Corphita

USA . 2,622 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Get ready to take your RF power applications to the next level with the BLF369,112 by NXP Semiconductors. Known for their top-notch quality and reliability, NXP Semiconductors has created a game-changing product that offers unmatched performance in amplifiers. Whether you're looking to boost signal strength or improve efficiency, this N-CHANNEL FET delivers exceptional results. With its common source configuration and dual elements, this transistor is designed to enhance your ultra-high frequency band projects. Say goodbye to subpar performance and hello to superior quality with the BLF369,112.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body material provides durability and reliability for the RF power FET, making it suitable for harsh operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher mobility and conductivity compared to P-channel FETs, allowing for better overall performance in amplification applications.

Configuration: COMMON SOURCE, 2 ELEMENTS

2-element common source configuration allows for efficient amplification and signal processing within the RF power FET.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal boosting and amplification tasks.

Surface Mount: YES

Surface mount capability enables easy and secure installation of the RF power FET on circuit boards, enhancing convenience and efficiency in manufacturing processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control of the transistor's functionality, enabling efficient signal amplification and processing.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature of 200°C, this RF power FET can function reliably in demanding high-temperature environments.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF369,112 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF369,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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