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LET9120

STMicroelectronics

LET9120 by STMicroelectronics

LET9120 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 18 A, breakdown voltage of 80 V, and operates in the L band. This surface-mount transistor excels in high-power scenarios with a dissipation of up to 200 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,940 parts In-Stock

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8,940

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Anansix

USA . 263 parts In-Stock

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263

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Digiode

USA . 166 parts In-Stock

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166

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,079 parts In-Stock

1+ parts

$0.801

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$0.721

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2,079

$0.801

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$0.721

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MKK Technologies

India . 1,135 parts In-Stock

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$1.507

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1,135

$1.507

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DigiPath Technology Company

USA . 1,135 parts In-Stock

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$1.507

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1,135

$1.507

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AZTECH Wire

Italy . 578 parts In-Stock

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$10.470

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578

$10.470

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Corphita

USA . 3,116 parts In-Stock

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3,116

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Parana Technologies

USA . 139 parts In-Stock

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$0.958

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139

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Perfect Parts

USA . 138 parts In-Stock

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Overview

Elevate your RF applications with the LET9120 from STMicroelectronics—a trusted leader in semiconductor innovation. This N-channel FET delivers exceptional performance as an amplifier, perfect for demanding environments. Encased in durable plastic/epoxy, it ensures reliability while handling up to 200W of power. Choose LET9120 for superior efficiency and longevity, enabling seamless integration into various high-frequency applications. Experience the quality that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials offers excellent thermal and chemical resistance, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors provide higher electron mobility, leading to improved efficiency and performance in amplification applications.

Configuration: SINGLE

A single configuration simplifies circuit design and reduces space requirements on PCBs, making it more efficient for compact designs.

Transistor Application: AMPLIFIER

Optimized for amplification, this FET is ideal for applications requiring signal enhancement in RF circuits.

Surface Mount: YES

Surface mounting allows for automated assembly, reducing manufacturing costs and improving reliability in high-density applications.

Minimum DS Breakdown Voltage: 80 V

This voltage rating ensures the transistor can handle high voltage conditions without failure, providing robustness in various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on circuit boards, facilitating better layout configurations.

Terminal Form: FLAT

Flat terminals improve contact area and reduce inductance, which is beneficial for high-frequency applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control over the output, making it suitable for precise amplification tasks.

Highest Frequency Band: L BAND

L band capabilities make this FET suitable for a variety of communications and broadcasting applications.

Maximum Drain Current (Abs) (ID): 18 A

A high maximum drain current rating allows this transistor to handle substantial loads, enhancing its versatility in various applications.

No. of Terminals: 4

The four-terminal design enables more flexible circuit configurations and simplifies connections in complex circuits.

Maximum Power Dissipation (Abs): 200 W

High power dissipation capability ensures the FET can operate efficiently without overheating, suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides secure mounting options, ensuring stability and durability in various operating conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances performance by minimizing on-resistance and improving switching speeds, ideal for RF applications.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature, this FET can be used in extreme environments without compromising performance.

Transistor Element Material: SILICON

Silicon is a well-established material in semiconductor technology, providing reliable and efficient performance in RF applications.

Maximum Drain Current (ID): 18 A

This specification allows the device to handle intensive applications and ensures reliable performance under heavy loads.

Terminal Position: DUAL

Dual terminal position enhances the electrical connection stability and offers design flexibility for different circuit configurations.

Case Connection: SOURCE

Source case connection optimizes heat dissipation, which is crucial for maintaining high performance during operation.

Technical Specifications

RF Power Field Effect Transistors (FET) LET9120 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET9120 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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