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PD20015STR-E

STMicroelectronics

PD20015STR-E by STMicroelectronics

PD20015STR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 7 A, a breakdown voltage of 40 V, and operates in the ultra-high frequency band. Its compact flange mount design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,562 parts In-Stock

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4,562

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Vyrian

USA . 1,054 parts In-Stock

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1,054

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Anansix

USA . 561 parts In-Stock

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561

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 168 parts In-Stock

1+ parts

$1.033

100+ parts

-

1k+ parts

$0.930

10k+ parts

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168

$1.033

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$0.930

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MKK Technologies

India . 903 parts In-Stock

1+ parts

$1.943

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903

$1.943

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DigiPath Technology Company

USA . 903 parts In-Stock

1+ parts

$1.943

100+ parts

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903

$1.943

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Corphita

USA . 4,464 parts In-Stock

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4,464

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Parana Technologies

USA . 2,060 parts In-Stock

1+ parts

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$1.235

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2,060

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$1.235

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Overview

Unlock superior performance with the PD20015STR-E from STMicroelectronics, a leading name in innovative semiconductor solutions. This N-channel RF Power FET, crafted for durability and efficiency, excels in high-frequency applications, making it perfect for amplifiers in communication systems. With outstanding power dissipation and thermal management, customers benefit from reliability and enhanced signal quality, ensuring their projects stand out in any competitive landscape. Upgrade your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and resistance to environmental factors, making it reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for higher efficiency and lower on-resistance, making them ideal for amplifier applications.

Configuration: SINGLE

A single configuration simplifies design and integration into circuits, offering a compact solution for RF amplification needs.

Transistor Application: AMPLIFIER

Tailored for amplification, this transistor ensures high-performance signal processing in RF applications.

Surface Mount: YES

Surface mount technology allows for easier assembly, saving space on PCB layouts and improving overall design efficiency.

Minimum DS Breakdown Voltage: 40 V

With a breakdown voltage of 40V, this FET can handle significant voltage levels, enhancing its reliability in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape promotes efficient use of space on PCBs, facilitating flexible design configurations.

Terminal Form: FLAT

Flat terminals allow for better soldering and connection stability, which is crucial for maintaining performance in RF applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures that the transistor is off by default, providing better control and efficiency in signal processing.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This capability makes the transistor suitable for applications involving very high frequencies, critical in RF communication technologies.

Maximum Drain Current (Abs) (ID): 7 A

A maximum drain current of 7A allows for robust performance in demanding applications, accommodating high current requirements.

No. of Terminals: 2

Having only two terminals simplifies connection and integration into circuits, reducing potential points of failure.

Maximum Power Dissipation (Abs): 79 W

With a high power dissipation rating, the transistor can handle substantial energy without overheating, ensuring reliability under load.

Package Style (Meter): FLANGE MOUNT

Flange mount style enhances thermal management and mechanical stability, making it suitable for various industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power loss, making this transistor efficient and effective in signal amplification.

Maximum Operating Temperature: 165 °C

A maximum operating temperature of 165 °C indicates this FET can perform effectively in high-heat environments, ensuring reliability in quality control.

Transistor Element Material: SILICON

Silicon as a semiconductor material is standard in FETs, providing excellent performance characteristics for RF applications.

Maximum Drain Current (ID): 7 A

Reiterating the current capacity, this FET can cater to high-performance requirements across a range of applications.

Terminal Position: DUAL

Dual terminal positioning can enhance circuit stability and connectivity options in PCB designs.

Case Connection: SOURCE

Source connection facilitates effective grounding and enhances performance in amplification settings.

Technical Specifications

RF Power Field Effect Transistors (FET) PD20015STR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD20015STR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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