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MRF8S21200HSR6

NXP Semiconductors

MRF8S21200HSR6 by NXP Semiconductors

NXP Semiconductors' MRF8S21200HSR6 is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage. It operates in S BAND, featuring COMMON SOURCE configuration for AMPLIFIER applications. The transistor has a max operating temperature of 225°C and comes in a FLATPACK package style.

Median Price

$96.530

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

MRF8S21200HSR6 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 139 parts In-Stock

1+ parts

$96.530

100+ parts

$94.610

1k+ parts

$92.680

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139

$96.530

$94.610

$92.680

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Flip Electronics (Authorized)

USA . 3,450 parts In-Stock

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Digiode

USA . 2,786 parts In-Stock

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$91.704

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2,786

$91.704

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Nova Conductors

Japan . 100 parts In-Stock

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$96.863

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100

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Flip Electronics

USA . 3,450 parts In-Stock

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Vyrian

USA . 1,440 parts In-Stock

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Anansix

USA . 162 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,766 parts In-Stock

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$0.830

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$0.830

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Semicontronic

India . 1,786 parts In-Stock

1+ parts

$82.050

100+ parts

$79.999

1k+ parts

$79.588

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1,786

$82.050

$79.999

$79.588

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Ampacity Inc.

Singapore . 1,713 parts In-Stock

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$82.050

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Corphita

USA . 2,394 parts In-Stock

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$86.877

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Netroflash

USA . 500 parts In-Stock

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$96.863

100+ parts

$94.926

1k+ parts

$92.020

10k+ parts

$90.083

500

$96.863

$94.926

$92.020

$90.083

Corohmni

South Africa . 243 parts In-Stock

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$96.863

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243

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Continental Prestige Electronics

USA . 89 parts In-Stock

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$131.350

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Microchip USA

USA . 11,942 parts In-Stock

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Argo Parts USA

USA . 4,706 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,386 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MRF8S21200HSR6 by NXP Semiconductors. This RF Power Field Effect Transistor is a game-changer in the world of amplifiers, offering unparalleled performance and reliability. With a ceramic, metal-sealed cofired package body material and an operating mode of enhancement, this transistor is designed for maximum efficiency in S Band applications. Experience seamless connectivity and superior signal amplification with the MRF8S21200HSR6, setting new standards in the industry. Elevate your projects with NXP Semiconductors' top-notch quality and innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent thermal stability and durability, making the product suitable for high power applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower conduction losses and faster switching speeds, making them ideal for high frequency applications.

Transistor Application: AMPLIFIER

The transistor is specifically designed for amplification of signals, ensuring optimal performance in amplification circuits.

Minimum DS Breakdown Voltage: 65 V

With a high breakdown voltage, the transistor can withstand high voltages, providing reliability in operation.

Highest Frequency Band: S BAND

Operating in the S band frequency range indicates that the transistor is suitable for applications requiring high frequency operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology provides high efficiency and low power consumption, making the product energy-efficient.

Maximum Operating Temperature: 225 °C

With a high maximum operating temperature, the transistor can operate reliably even in high temperature environments.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF8S21200HSR6 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-CDFP-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF8S21200HSR6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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