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SD2920-02

STMicroelectronics

SD2920-02 by STMicroelectronics

SD2920-02 by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 27.8 A, a breakdown voltage of 125 V, and operates in the very high frequency band. Its robust ceramic-metal sealed package ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,942 parts In-Stock

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4,942

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Vyrian

USA . 3,306 parts In-Stock

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3,306

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Anansix

USA . 281 parts In-Stock

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281

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,841 parts In-Stock

1+ parts

$1.251

100+ parts

-

1k+ parts

$1.126

10k+ parts

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1,841

$1.251

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$1.126

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MKK Technologies

India . 1,984 parts In-Stock

1+ parts

$2.353

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1,984

$2.353

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DigiPath Technology Company

USA . 1,984 parts In-Stock

1+ parts

$2.353

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1,984

$2.353

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Parana Technologies

USA . 1,487 parts In-Stock

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100+ parts

$1.496

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1,487

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$1.496

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Corphita

USA . 209 parts In-Stock

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Overview

Elevate your RF applications with the SD2920-02 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality N-channel FET is designed for superior amplification, ensuring robust performance even in demanding environments. With its advanced ceramic and metal-sealed package, you gain exceptional thermal stability and reliability. Experience enhanced efficiency and precision in your designs, making it the ideal choice for cutting-edge communication systems and high-frequency applications.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This construction ensures durability and reliability, making it suitable for demanding environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are often more efficient and provide better performance in high-speed applications.

Configuration: SINGLE

A single configuration provides simplicity and ease of integration in various circuit designs.

Transistor Application: AMPLIFIER

Optimized for amplification, this FET is ideal for applications requiring signal boosting.

Surface Mount: YES

The surface mount feature facilitates automated assembly and saves PCB space.

Minimum DS Breakdown Voltage: 125 V

A high breakdown voltage makes it suitable for high-voltage applications, increasing design flexibility.

Package Shape: RECTANGULAR

Rectangular packages allow for efficient space utilization on PCBs and can support high power densities.

Terminal Form: FLAT

Flat terminals enhance contact reliability and ease of soldering in surface mount applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for high input impedance and lower power consumption, improving efficiency.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Designed for very high frequency applications, this transistor is suitable for RF communication technologies.

No. of Terminals: 4

Four terminals allow for versatile circuit configurations and facilitate more complex functionalities.

Package Style (Meter): FLANGE MOUNT

Flange mount design ensures secure attachment to heatsinks, aiding in thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high efficiency and excellent switching characteristics, making it ideal for RF applications.

Maximum Operating Temperature: 200 °C

The high operating temperature capability allows for use in extreme environments without compromising performance.

Transistor Element Material: SILICON

Silicon-based transistors deliver reliable performance, high thermal conductivity, and good frequency response.

Maximum Drain Current (ID): 27.8 A

A high maximum drain current allows for more power handling, making it suitable for high-power applications.

Terminal Position: DUAL

Dual terminal configuration can ease layout and improve signal integrity in RF circuits.

Case Connection: SOURCE

Direct source connection helps in efficient circuit layout and improves thermal dissipation.

Technical Specifications

RF Power Field Effect Transistors (FET) SD2920-02 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

125 V

Maximum Drain Current (ID):

27.8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

SD2920-02 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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