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PD55008L

STMicroelectronics

PD55008L by STMicroelectronics

PD55008L by STMicroelectronics is an N-CHANNEL RF Power FET with 40V DS Breakdown Voltage, suitable for AMPLIFIER applications. It operates in ENHANCEMENT MODE at ULTRA HIGH FREQUENCY BAND, with 5A max Drain Current and 45W Power Dissipation. Package style is CHIP CARRIER, ideal for SOURCE connection in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,420 parts In-Stock

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3,420

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Anansix

USA . 2,095 parts In-Stock

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2,095

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Vyrian

USA . 888 parts In-Stock

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888

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 327 parts In-Stock

1+ parts

$0.634

100+ parts

-

1k+ parts

$0.570

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327

$0.634

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$0.570

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MKK Technologies

India . 2,120 parts In-Stock

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$1.192

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$1.192

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DigiPath Technology Company

USA . 2,120 parts In-Stock

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$1.192

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$1.192

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Semicontronic

India . 1,199 parts In-Stock

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$10.050

100+ parts

$9.799

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$9.748

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1,199

$10.050

$9.799

$9.748

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AZTECH Wire

Italy . 281 parts In-Stock

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$13.721

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281

$13.721

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Ampacity Inc.

Singapore . 673 parts In-Stock

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$64.050

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673

$64.050

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Continental Prestige Electronics

USA . 5,397 parts In-Stock

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Corphita

USA . 3,819 parts In-Stock

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Parana Technologies

USA . 2,188 parts In-Stock

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$0.758

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2,188

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$0.758

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Argo Parts USA

USA . 670 parts In-Stock

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670

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Aranea Global

USA . 50 parts In-Stock

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Overview

Unleash the power of innovation with the STMicroelectronics PD55008L RF Power Field Effect Transistor. Designed to deliver exceptional performance in amplifier applications, this N-CHANNEL transistor boasts a single configuration and operates in enhancement mode, making it ideal for ultra-high frequency bands. With a maximum power dissipation of 45W and a minimum DS breakdown voltage of 40V, this transistor offers unparalleled reliability and efficiency. Trust in STMicroelectronics, a leading manufacturer known for superior quality and cutting-edge technology, to bring you the best in semiconductor solutions. Elevate your projects to new heights with the PD55008L - where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external factors, making this product a reliable choice.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer high efficiency and fast switching speeds, making them ideal for high-performance amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design and saves space, making this transistor a practical choice for various amplifier setups.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, this transistor ensures optimal performance and reliable signal amplification.

Surface Mount: YES

With surface mount capability, this transistor is easy to install and suitable for compact circuit designs in modern electronic devices.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage of 40V provides robust protection against voltage spikes, ensuring the longevity of the transistor in voltage-sensitive applications.

Package Shape: SQUARE

The square package shape allows for easy mounting and provides a stable foundation for the transistor within the circuit.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation process and reduces the risk of solder joint failure, ensuring a secure connection.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for easy control of the transistor's conductivity, enabling precise amplification and signal processing.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

With support for ultra-high frequency bands, this transistor is ideal for high-speed data transmission and wireless communications applications.

Maximum Drain Current (Abs) (ID): 4 A

The high maximum drain current of 4A allows for reliable power handling and efficient signal amplification in demanding amplifier circuits.

No. of Terminals: 5

With 5 terminals for connection, this transistor offers versatile circuit design options and compatibility with various amplifier configurations.

Maximum Power Dissipation (Abs): 45 W

The high maximum power dissipation of 45W ensures efficient heat management and reliable performance in demanding amplifier applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compact size and efficient thermal conductivity, making this transistor suitable for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of metal-oxide semiconductor technology ensures high reliability and low power consumption, making this transistor a sustainable choice for amplifier circuits.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments and maintain stable performance.

Transistor Element Material: SILICON

The use of silicon material in the transistor element ensures high conductivity and reliability, making it a durable and efficient choice for amplifier applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and corrosion resistance, ensuring a secure and reliable connection in circuit assemblies.

Maximum Drain Current (ID): 5 A

The high maximum drain current of 5A allows for increased power handling and robust performance in demanding amplifier applications.

Terminal Position: QUAD

With a quad terminal position, this transistor offers convenient installation and versatile connection options for various amplifier circuit configurations.

Case Connection: SOURCE

The source case connection simplifies circuit design and enables easy integration with other components, making this transistor a versatile choice for amplifier applications.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55008L attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

S-PQCC-N5

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55008L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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