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PD55035S

STMicroelectronics

PD55035S by STMicroelectronics

PD55035S by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 8.5 A, operates at ultra-high frequencies, and withstands up to 165 °C. Ideal for compact surface mount designs in demanding environments.

Median Price

$67.030

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,119 parts In-Stock

1+ parts

$67.030

100+ parts

-

1k+ parts

-

10k+ parts

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2,119

$67.030

-

-

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Anansix

USA . 2,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,643

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Digiode

USA . 77 parts In-Stock

1+ parts

-

100+ parts

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77

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,744 parts In-Stock

1+ parts

$0.392

100+ parts

-

1k+ parts

$0.353

10k+ parts

-

1,744

$0.392

-

$0.353

-

MKK Technologies

India . 1,595 parts In-Stock

1+ parts

$0.737

100+ parts

-

1k+ parts

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10k+ parts

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1,595

$0.737

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DigiPath Technology Company

USA . 1,595 parts In-Stock

1+ parts

$0.737

100+ parts

-

1k+ parts

-

10k+ parts

-

1,595

$0.737

-

-

-

Parana Technologies

USA . 1,838 parts In-Stock

1+ parts

-

100+ parts

$0.469

1k+ parts

-

10k+ parts

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1,838

-

$0.469

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Corphita

USA . 810 parts In-Stock

1+ parts

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810

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Overview

Unlock superior performance with the PD55035S from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality RF Power FET is engineered for versatility, making it ideal for high-frequency amplifier applications. With its robust construction and efficient design, it delivers exceptional reliability and efficiency in demanding environments. Trust STMicroelectronics to enhance your projects with the power and precision you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and protects the transistor from environmental factors, enhancing its longevity and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are generally preferred for their superior performance in terms of efficiency and switching capabilities, making this product ideal for high-end applications.

Configuration: SINGLE

A single configuration reduces complexity, allowing for easier integration into various circuits without compromising performance.

Transistor Application: AMPLIFIER

Designed for amplification, this transistor is a great choice for audio and radio frequency applications, ensuring high signal fidelity.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on PCBs, catering to modern electronic device requirements.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40V provides robust performance, making the transistor suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on PCB layouts, allowing for more compact designs.

Terminal Form: FLAT

Flat terminals provide a stable connection to the PCB, ensuring reliability in signal transmission and minimizing the risk of connection issues.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures that the transistor remains off until a signal is applied, making it suitable for low-power applications and efficient circuit designs.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band allows for versatile applications, including communications and broadcast systems, where high frequency is necessary.

Maximum Drain Current (Abs) (ID): 8.5 A

The ability to handle up to 8.5 A enables the transistor to be used in high-current applications, providing versatility for different electronic designs.

No. of Terminals: 2

Having two terminals simplifies circuit design and integration while maintaining effective performance for simpler applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact design, making it an excellent choice for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology is well-known for its low power consumption and high efficiency, which enhances overall circuit performance.

Maximum Operating Temperature: 165 °C

A high maximum operating temperature allows the transistor to perform in demanding environments, providing greater design flexibility.

Transistor Element Material: SILICON

Silicon as the base material ensures excellent thermal stability and reliability in the transistor's operation across various conditions.

Terminal Finish: TIN LEAD

Tin lead finishes offer good solderability, ensuring solid connections during assembly and enhancing long-term reliability.

Maximum Drain Current (ID): 7 A

A maximum drain current capability of 7 A allows the transistor to be used in significant power applications while maintaining efficiency.

Terminal Position: DUAL

Dual terminal positioning facilitates flexibility in circuit board design and layout, allowing for easier integration into various systems.

Case Connection: SOURCE

A source connection in the case design ensures effective grounding and enhances the overall functionality of the transistor in various applications.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55035S attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

8.5 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55035S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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