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PD55035TR-E

STMicroelectronics

PD55035TR-E by STMicroelectronics

PD55035TR-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 7 A, a breakdown voltage of 40 V, and operates in the ultra-high frequency band. This surface-mount transistor ensures efficient performance with a max power dissipation of 95 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,881 parts In-Stock

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2,881

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Vyrian

USA . 2,577 parts In-Stock

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2,577

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Anansix

USA . 860 parts In-Stock

1+ parts

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860

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,819 parts In-Stock

1+ parts

$0.620

100+ parts

-

1k+ parts

$0.558

10k+ parts

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1,819

$0.620

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$0.558

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MKK Technologies

India . 1,666 parts In-Stock

1+ parts

$1.166

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1,666

$1.166

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DigiPath Technology Company

USA . 1,666 parts In-Stock

1+ parts

$1.166

100+ parts

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1,666

$1.166

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Corphita

USA . 3,364 parts In-Stock

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3,364

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Parana Technologies

USA . 320 parts In-Stock

1+ parts

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100+ parts

$0.741

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320

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$0.741

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Overview

Unlock unmatched performance with the PD55035TR-E from STMicroelectronics, a leader in innovative semiconductor solutions. This cutting-edge RF Power FET offers exceptional reliability and efficiency for your amplifier applications, making it perfect for ultra-high frequency operations. With robust power handling and a compact design, it streamlines your projects while ensuring superior signal integrity. Elevate your designs with STMicroelectronics' commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making it reliable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for higher efficiency and faster switching speeds, making them ideal for amplifier applications.

Configuration: SINGLE

A single configuration ensures simplicity in circuit design while maintaining efficient performance.

Transistor Application: AMPLIFIER

Designed specifically for amplifier use, ensuring optimized performance in audio and RF applications.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and improved manufacturing efficiency.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET is suitable for high-voltage applications, providing greater flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of space on the PCB, facilitating compact designs.

Terminal Form: GULL WING

Gull wing terminals provide easier soldering and better thermal performance, enhancing reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation improves the overall performance and efficiency of the circuit.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Able to handle ultra-high frequency signals, making it suitable for various RF applications.

Maximum Drain Current (Abs) (ID): 7 A

A maximum drain current of 7 A makes this FET capable of handling substantial loads, adding to its versatility.

No. of Terminals: 2

A two-terminal design minimizes complexity and simplifies integration into circuits.

Maximum Power Dissipation (Abs): 95 W

With a maximum power dissipation of 95 W, this FET can handle significant power without overheating, ensuring reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs while providing good thermal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, enhancing operational efficiency.

Maximum Operating Temperature: 165 °C

A high maximum operating temperature indicates robustness and suitability for demanding environments.

Transistor Element Material: SILICON

Silicon material ensures effective thermal conductivity and stability, contributing to overall performance.

Maximum Drain Current (ID): 7 A

Reiterating the maximum drain current capability, adding assurance of the FET's performance under load.

Terminal Position: DUAL

Dual terminal positions facilitate flexible placement on the PCB for optimized layout.

Case Connection: SOURCE

A dedicated source connection simplifies circuit integration and improves performance.

Technical Specifications

RF Power Field Effect Transistors (FET) PD55035TR-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD55035TR-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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