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PD85015S-E

STMicroelectronics

PD85015S-E by STMicroelectronics

PD85015S-E by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 5 A, a breakdown voltage of 40 V, and operates in the ultra-high frequency band. This surface-mount transistor ensures efficient performance with a max power dissipation of 59 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,674 parts In-Stock

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4,674

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Digiode

USA . 3,440 parts In-Stock

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3,440

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Anansix

USA . 2,736 parts In-Stock

1+ parts

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2,736

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,725 parts In-Stock

1+ parts

$0.753

100+ parts

-

1k+ parts

$0.677

10k+ parts

-

1,725

$0.753

-

$0.677

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Advanced Electronics

New Zealand . 247 parts In-Stock

1+ parts

$1.307

100+ parts

$1.189

1k+ parts

$1.072

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247

$1.307

$1.189

$1.072

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MKK Technologies

India . 1,593 parts In-Stock

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$1.415

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1,593

$1.415

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DigiPath Technology Company

USA . 1,593 parts In-Stock

1+ parts

$1.415

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1,593

$1.415

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AZTECH Wire

Italy . 115 parts In-Stock

1+ parts

$9.830

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115

$9.830

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Component Stockers USA

USA . 435 parts In-Stock

1+ parts

$99.990

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435

$99.990

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Corphita

USA . 3,415 parts In-Stock

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3,415

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Parana Technologies

USA . 1,022 parts In-Stock

1+ parts

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$0.900

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1,022

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$0.900

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Overview

Unlock unparalleled performance with the PD85015S-E by STMicroelectronics, a leader in semiconductor innovation. This N-Channel RF Power FET excels in amplifying signals for ultra-high frequency applications, delivering robust reliability and efficiency. With a sleek flatpack design and superior thermal management, it’s perfect for demanding environments. Choose the PD85015S-E for cutting-edge technology that enhances your projects, ensuring quality and durability every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, ensuring reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher electron mobility, which results in better performance and efficiency, making them suitable for high-speed applications.

Configuration: SINGLE

A single configuration simplifies design and reduces the complexity of circuit layouts, making it easier to integrate into various applications.

Transistor Application: AMPLIFIER

Designed for amplification, this FET is ideal for various applications requiring signal boosting, enhancing overall circuit performance.

Surface Mount: YES

Surface mount capability allows for more compact designs and easier automated assembly, making it suitable for modern electronic devices.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle significant voltage levels, enhancing the robustness of the overall circuit.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization and is compatible with various PCB designs.

Terminal Form: FLAT

Flat terminals ensure secure connections and lower inductance, resulting in improved performance at high frequencies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control of the device, ensuring efficient performance in amplifying applications.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra-high frequency band makes this FET suitable for modern RF applications, enhancing signal integrity and bandwidth.

Maximum Drain Current (Abs) (ID): 5 A

A maximum drain current of 5 A enables the FET to handle substantial loads, making it ideal for high-power applications.

No. of Terminals: 2

Having only two terminals simplifies the circuit design and reduces footprint, making it suitable for tight layouts.

Maximum Power Dissipation (Abs): 59 W

With a high power dissipation capability, this FET can handle intense power levels, thus improving the reliability of the application.

Package Style (Meter): FLATPACK

The flatpack style contributes to ease of handling and installation, promoting efficient thermal performance and connectivity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making this FET ideal for versatile electronic applications.

Maximum Operating Temperature: 165 °C

Operating at high temperatures means this FET is resilient to extreme conditions, particularly in industrial or high-performance environments.

Transistor Element Material: SILICON

Silicon as the element material ensures good electrical characteristics and thermal stability, enhancing overall device reliability.

Maximum Drain Current (ID): 5 A

With a maximum drain current of 5 A, this FET can effectively drive significant loads, ensuring performance in high-current applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexible circuit configurations, simplifying design choices and optimizing space in PCB layouts.

Case Connection: SOURCE

The source case connection ensures that the FET is easy to connect in circuits and promotes consistent electrical properties during operation.

Technical Specifications

RF Power Field Effect Transistors (FET) PD85015S-E attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFP-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

165 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

PD85015S-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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