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LET19060C

STMicroelectronics

LET19060C by STMicroelectronics

LET19060C by STMicroelectronics is an N-channel RF power FET designed for amplifier applications. It features a max drain current of 7 A, a breakdown voltage of 65 V, and operates in the ultra-high frequency band. This surface-mount transistor excels in high-power scenarios with a dissipation of up to 130 W.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,700 parts In-Stock

1+ parts

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2,700

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Anansix

USA . 2,609 parts In-Stock

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2,609

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Digiode

USA . 148 parts In-Stock

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148

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 466 parts In-Stock

1+ parts

$1.513

100+ parts

-

1k+ parts

$1.362

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466

$1.513

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$1.362

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MKK Technologies

India . 1,394 parts In-Stock

1+ parts

$2.846

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1,394

$2.846

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DigiPath Technology Company

USA . 1,394 parts In-Stock

1+ parts

$2.846

100+ parts

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1,394

$2.846

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Corphita

USA . 2,841 parts In-Stock

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2,841

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Parana Technologies

USA . 991 parts In-Stock

1+ parts

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$1.810

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991

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$1.810

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Overview

Elevate your designs with the LET19060C from STMicroelectronics, a trusted leader in high-performance RF Power FETs. This exceptional N-channel transistor delivers unparalleled amplification at ultra-high frequencies, ensuring robust signal integrity for diverse applications. With its advanced construction and superior thermal management, the LET19060C not only enhances device reliability but also optimizes performance, providing you with unmatched value and efficiency for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are often favored for their superior efficiency and higher mobility of electrons, enhancing performance in amplifier applications.

Configuration: COMMON SOURCE, 2 ELEMENTS

This configuration allows for high voltage gain, making it ideal for amplification purposes while maintaining simplicity in circuit design.

Transistor Application: AMPLIFIER

Designed specifically for amplification, this FET is optimized for various signal processing applications, ensuring high fidelity and performance.

Surface Mount: YES

Surface mount technology allows for smaller designs, facilitating higher density circuit layouts and better thermal performance.

Minimum DS Breakdown Voltage: 65 V

A breakdown voltage of 65 V ensures reliable operation in high-voltage applications while protecting against damage.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on PCBs, allowing for versatile integration into different designs.

Terminal Form: FLAT

Flat terminals facilitate easier soldering and better thermal contact, improving overall reliability and performance of the device.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control over the on/off states, making the transistor more energy-efficient.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

This capability ensures that the FET can operate effectively at high frequencies, making it suitable for telecommunications and RF applications.

No. of Elements: 2

Having two elements allows for simultaneous amplification and increased versatility in circuit design.

Maximum Drain Current (Abs) (ID): 7 A

A maximum drain current of 7 A enables the transistor to handle significant loads, making it suitable for various high-power applications.

No. of Terminals: 2

With only two terminals, this FET is easy to integrate into circuits, minimizing complexity while maximizing efficiency.

Maximum Power Dissipation (Abs): 130 W

The ability to dissipate up to 130 W ensures that the transistor can operate under demanding conditions without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure mounting options, enhancing mechanical stability in applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables increased efficiency, faster switching, and lower power consumption, making this FET highly effective.

Maximum Operating Temperature: 200 °C

A maximum operating temperature of 200 °C allows for reliable performance in extreme conditions, making this FET suitable for demanding environments.

Transistor Element Material: SILICON

Silicon is a widely used material for its excellent semiconductor properties, ensuring reliability and efficiency in various applications.

Terminal Position: DUAL

Dual terminal configuration offers flexibility in circuit design and connection, making it easier to integrate into various systems.

Case Connection: SOURCE

The source connection simplifies layout and improves thermal performance, critical in high-power applications.

Technical Specifications

RF Power Field Effect Transistors (FET) LET19060C attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDFM-F2

No. of Elements:

2

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

LET19060C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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