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AFV10700HSR5

NXP Semiconductors

AFV10700HSR5 by NXP Semiconductors

AFV10700HSR5 by NXP Semiconductors is an N-CHANNEL RF Power FET with a min DS Breakdown Voltage of 105V and a Min Power Gain of 18dB. Commonly used in amplifiers, it operates in the L BAND frequency range. This CERAMIC, METAL-SEALED COFIRED transistor has a max operating temperature of 225°C and can handle peak reflow temperatures up to 260°C.

Median Price

$632.532

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 591 parts In-Stock

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$562.250

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$528.520

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$494.780

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591

$562.250

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$494.780

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Verical

USA . 591 parts In-Stock

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$702.813

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$660.650

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$618.475

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591

$702.813

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$618.475

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Flip Electronics (Authorized)

USA . 450 parts In-Stock

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450

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Digiode

USA . 4,198 parts In-Stock

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$442.994

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$442.994

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Nova Conductors

Japan . 650 parts In-Stock

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$482.801

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650

$482.801

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Vyrian

USA . 4,716 parts In-Stock

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Anansix

USA . 1,867 parts In-Stock

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VNN

France . 759 parts In-Stock

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Flip Electronics

USA . 450 parts In-Stock

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450

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Distributors (Availability)

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Continental Prestige Electronics

USA . 50 parts In-Stock

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$273.000

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50

$273.000

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Ampacity Inc.

Singapore . 178 parts In-Stock

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$396.360

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Corphita

USA . 4,926 parts In-Stock

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$419.679

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Argo Parts USA

USA . 4,902 parts In-Stock

1+ parts

$482.801

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$477.973

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$473.145

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$468.317

4,902

$482.801

$477.973

$473.145

$468.317

UNI Independent Distributors

Spain . 8,208 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Overview

Experience superior performance and reliability with the AFV10700HSR5 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers high-quality RF Power Field Effect Transistors that are perfect for amplifier applications in the L Band. With a minimum DS breakdown voltage of 105V and a minimum power gain of 18dB, this N-Channel transistor offers exceptional value to customers seeking top-notch performance. Trust NXP Semiconductors for cutting-edge technology and innovation in semiconductor solutions.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED

This durable material ensures the RF Power FET can withstand high temperatures and harsh environments, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration offers high efficiency and low on-resistance, making this FET ideal for high-frequency amplification.

Configuration: COMMON SOURCE, 2 ELEMENTS

With a common source and 2 elements, this FET provides excellent power gain and efficiency for amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier use, this RF Power FET offers superior performance and reliability in amplification tasks.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation, making this FET suitable for modern compact electronics.

Minimum DS Breakdown Voltage: 105 V

The high breakdown voltage ensures stability and protection against voltage surges, making this FET a reliable choice for demanding applications.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and space-saving design, making this FET suitable for applications with limited space.

Terminal Form: FLAT

The flat terminal form allows for easy soldering and connection, ensuring a secure and stable electrical connection.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation offers precise control and high performance, making this FET suitable for specialized applications.

Highest Frequency Band: L BAND

Operating in the L band frequency range, this FET is perfect for high-frequency applications such as radar and communication systems.

Technical Specifications

RF Power Field Effect Transistors (FET) AFV10700HSR5 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

105 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1.16 pF

Highest Frequency Band:

L BAND

JESD-30 Code:

R-CDFP-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

225 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Minimum Power Gain (Gp):

18 dB

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

AFV10700HSR5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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