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AFV10700GSR5

NXP Semiconductors

AFV10700GSR5 by NXP Semiconductors

N-CHANNEL; Configuration: COMMON SOURCE, 2 ELEMENTS; Surface Mount: YES; Terminal Form: GULL WING; Peak Reflow Temperature (C): 260; Package Body Material: CERAMIC, METAL-SEALED COFIRED;

Median Price

$640.150

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Richardson RFPD

USA . 44 parts In-Stock

1+ parts

$523.090

100+ parts

$483.250

1k+ parts

-

10k+ parts

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44

$523.090

$483.250

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-

RFMW

USA . 131 parts In-Stock

1+ parts

$542.130

100+ parts

-

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-

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131

$542.130

-

-

-

Rochester

USA . 10 parts In-Stock

1+ parts

$640.150

100+ parts

$601.740

1k+ parts

$563.330

10k+ parts

-

10

$640.150

$601.740

$563.330

-

Chip1Stop

Japan . 48 parts In-Stock

1+ parts

$750.000

100+ parts

$735.000

1k+ parts

-

10k+ parts

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48

$750.000

$735.000

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-

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$764.514

1k+ parts

-

10k+ parts

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10,000

-

$764.514

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Flip Electronics (Authorized)

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

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100

-

-

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,162 parts In-Stock

1+ parts

$496.936

100+ parts

-

1k+ parts

-

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1,162

$496.936

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Vyrian

USA . 6,130 parts In-Stock

1+ parts

-

100+ parts

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6,130

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Anansix

USA . 534 parts In-Stock

1+ parts

-

100+ parts

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534

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Flip Electronics

USA . 100 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 996 parts In-Stock

1+ parts

$5.700

100+ parts

-

1k+ parts

-

10k+ parts

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996

$5.700

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AZTECH Wire

Italy . 38 parts In-Stock

1+ parts

$16.660

100+ parts

-

1k+ parts

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38

$16.660

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Corphita

USA . 4,461 parts In-Stock

1+ parts

$470.781

100+ parts

-

1k+ parts

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10k+ parts

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4,461

$470.781

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Component Stockers USA

USA . 14 parts In-Stock

1+ parts

$6,618.790

100+ parts

-

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14

$6,618.790

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UNI Independent Distributors

Spain . 7,794 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,794

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

-

-

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Northwest PG Solutions

USA . 488 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.586

10k+ parts

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488

-

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$5.586

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Technical Specifications

RF Power Field Effect Transistors (FET) AFV10700GSR5 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

105 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JESD-30 Code:

R-CDSO-G4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

AFV10700GSR5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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