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GS66508T-TR

Gan Systems

GS66508T-TR by Gan Systems

GS66508T-TR by Gan Systems is a N-CHANNEL FET for SWITCHING applications. With 650V DS Breakdown Voltage, it operates in ENHANCEMENT MODE at -55 to 150°C. Utilizing GALLIUM NITRIDE technology, it handles up to 30A ID in VERY HIGH FREQUENCY BAND operations.

Median Price

$20.460

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,469 parts In-Stock

1+ parts

$20.460

100+ parts

$15.910

1k+ parts

$14.840

10k+ parts

-

1,469

$20.460

$15.910

$14.840

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$13.710

100+ parts

-

1k+ parts

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44

$13.710

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Sensible Micro Corp

USA . 10,070 parts In-Stock

1+ parts

-

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10,070

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Vyrian

USA . 2,929 parts In-Stock

1+ parts

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2,929

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 266 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

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266

$0.780

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Continental Prestige Electronics

USA . 6,574 parts In-Stock

1+ parts

$11.630

100+ parts

-

1k+ parts

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10k+ parts

$11.397

6,574

$11.630

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-

$11.397

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$11.863

100+ parts

$11.863

1k+ parts

$11.863

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100

$11.863

$11.863

$11.863

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Netroflash

USA . 50 parts In-Stock

1+ parts

$13.710

100+ parts

-

1k+ parts

$13.025

10k+ parts

$12.750

50

$13.710

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$13.025

$12.750

Argo Parts USA

USA . 2,358 parts In-Stock

1+ parts

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2,358

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Overview

Infineon Technologies GS665xx Enhancement-Mode High Electron Mobility Transistors (E-HEMT) feature high current, high voltage breakdown, and high switching frequency. These power transistors include Island Technology cell layout with high-current die and high yield, and GaNPX®  small packaging enables low inductance and low thermal resistance. These power transistors offer very low junction-to-case thermal resistance for high-power applications. The GS665xx enhancement-mode silicon power transistors are available as bottom-sided or top-sided cooled transistors. These power transistors provide ultra-low FOM die, reverse current capability, and zero reverse recovery loss.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL FETs offer lower on-state resistance and higher switching speeds compared to P-CHANNEL FETs, making them a better choice for high power applications.

Configuration

Single FET configurations are simpler to design with and offer better thermal performance compared to parallel configurations.

Transistor Application

Designed specifically for switching applications, ensuring efficient and reliable performance in high-frequency switching circuits.

Minimum DS Breakdown Voltage

High breakdown voltage allows for reliable operation in high voltage circuits, offering protection against voltage spikes and surges.

Package Shape

Rectangular packages are easy to handle and mount, providing a compact and efficient solution for surface mount applications.

Operating Mode

Enhancement mode FETs offer fast switching speeds and low on-state resistance, ideal for high frequency and high power applications.

Field Effect Transistor Technology

MOSFET technology provides high efficiency and fast switching speeds, making it suitable for high frequency applications.

Maximum Operating Temperature

High maximum operating temperature allows for reliable performance in demanding environments, ensuring long-term stability.

Transistor Element Material

Gallium Nitride FETs offer higher breakdown voltage and lower conduction losses, making them suitable for high power and high frequency applications.

Maximum Drain Current (ID)

High drain current rating allows for handling high power levels, making it suitable for high current switching applications.

Technical Specifications

RF Power Field Effect Transistors (FET) GS66508T-TR attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Gan Systems

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

30 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-XBCC-N4

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

Gold (Au) - with Nickel (Ni) barrier

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

GALLIUM NITRIDE

Trade Compliance

GS66508T-TR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Gan Systems

We live in a data and energy driven world increasingly defined by power-reliant industries including data centers, electric vehicles, renewable energy systems, industrial motors, and consumer electronics. These businesses have long faced formidable and universal challenges around energy wasted in power conversion, as well as the size limitations placed on overall product design by the old generation ecosystem of power system components. Yesterday’s silicon has reached its limits. GaN technology is the clear and undisputed solution for today and tomorrow. GaN Systems’ approach to a new generation of GaN power transistors is leading an industry-changing shift in both the short-term and ‘near future’ relationship between technology’s power systems and energy–creating significant product and system-wide changes. Design engineers are building power systems that are: · one-quarter the power loss · one-quarter the size · one-quarter the weight · and less expensive than silicon-based solutions For corporate leaders, GaN not only changes their company’s immediate relationship with power; it can alter the competitive trajectory of the entire business through the creation of whole new classes of products, systems, and sustainability initiatives.

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