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GS66516B-TR

Gan Systems

GS66516B-TR by Gan Systems

GS66516B-TR by Gan Systems is a P-CHANNEL RF FET for SWITCHING applications. Features include 650V DS Breakdown Voltage, 60A ID, and VERY HIGH FREQUENCY BAND operation. With NO LEAD terminals in a CHIP CARRIER package, it offers ENHANCEMENT MODE performance for SOURCE connections.

Median Price

$49.490

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,393 parts In-Stock

1+ parts

$49.490

100+ parts

$38.710

1k+ parts

$34.230

10k+ parts

$34.200

1,393

$49.490

$38.710

$34.230

$34.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 1,934 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,934

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

iBuyXS LLC

. 1,934 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,934

-

-

-

-

Overview

Experience unrivaled performance and reliability with the GS66516B-TR by Gan Systems, a leading manufacturer in RF Power Field Effect Transistors. Ideal for switching applications in the very high-frequency band, this P-channel single configuration transistor offers a breakthrough in power efficiency and speed. With a high DS breakdown voltage of 650V and a maximum drain current of 60A, this enhancement-mode transistor ensures superior performance in demanding environments. Trust Gan Systems to deliver cutting-edge technology that elevates your projects to new heights of success.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-state resistance and high current-carrying capability, making them suitable for high-power applications.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage ensures that the transistor can handle high voltage applications without breakdown, making it reliable and durable.

Transistor Application: SWITCHING

Designed for switching applications, this FET allows for fast switching speeds and efficient performance in power management applications.

Surface Mount: YES

Surface mount technology makes it easier to integrate the transistor onto circuit boards, saving space and improving overall efficiency.

Maximum Drain Current (ID): 60 A

With a high drain current capacity, this FET can handle high currents without overheating, making it suitable for power amplification and high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low on-resistance and high switching speeds, providing efficient power management and high-performance capabilities.

Technical Specifications

RF Power Field Effect Transistors (FET) GS66516B-TR attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from Gan Systems

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

60 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-XBCC-N6

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

GS66516B-TR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Gan Systems

We live in a data and energy driven world increasingly defined by power-reliant industries including data centers, electric vehicles, renewable energy systems, industrial motors, and consumer electronics. These businesses have long faced formidable and universal challenges around energy wasted in power conversion, as well as the size limitations placed on overall product design by the old generation ecosystem of power system components. Yesterday’s silicon has reached its limits. GaN technology is the clear and undisputed solution for today and tomorrow. GaN Systems’ approach to a new generation of GaN power transistors is leading an industry-changing shift in both the short-term and ‘near future’ relationship between technology’s power systems and energy–creating significant product and system-wide changes. Design engineers are building power systems that are: · one-quarter the power loss · one-quarter the size · one-quarter the weight · and less expensive than silicon-based solutions For corporate leaders, GaN not only changes their company’s immediate relationship with power; it can alter the competitive trajectory of the entire business through the creation of whole new classes of products, systems, and sustainability initiatives.

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