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M58LW032D110N6

STMicroelectronics

M58LW032D110N6 by STMicroelectronics

M58LW032D110N6 from STMicroelectronics is a 32Mbit NOR Flash memory with a 3V supply, featuring asynchronous operation and a max access time of 110 ns. It operates in extreme temperatures (-40 °C to 85 °C) and supports dual terminal positioning. Ideal for industrial applications requiring reliable data storage.

Median Price

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Lifecycle Status

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Vyrian

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Anansix

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Digiode

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Prism Electronics

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Cyclops Electronics Ltd

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Sensible Micro Corp

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LWI Electronics Inc

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Bristol Electronics

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Connector Distribution Corp

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Right Parts Inc.

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Electronics Depot

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 139 parts In-Stock

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$4.783

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$4.305

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MKK Technologies

India . 1,391 parts In-Stock

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DigiPath Technology Company

USA . 1,391 parts In-Stock

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AZTECH Wire

Italy . 753 parts In-Stock

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Microchip USA

USA . 145 parts In-Stock

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A-Z Elektronik GmbH

Germany . 12,665 parts In-Stock

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Alle Elektronik GmbH

Germany . 8,443 parts In-Stock

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Corphita

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Parana Technologies

USA . 2,277 parts In-Stock

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Assy Fe

Spain . 2,133 parts In-Stock

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Perfect Parts

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Kepictronics

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Speed Components Ltd (Excess)

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Overview

Unlock limitless possibilities with the M58LW032D110N6 flash memory from STMicroelectronics. Renowned for their commitment to innovation and quality, STMicroelectronics delivers a robust solution designed for a variety of applications, from industrial control systems to consumer electronics. Experience superior performance and reliability, ensuring your devices operate flawlessly under extreme conditions. Choose M58LW032D110N6 for unmatched efficiency and peace of mind in every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability and longevity in various environments.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, enabling compact device design.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space efficiency on circuit boards.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies design, providing faster access times and ease of integration.

Nominal Supply Voltage / Vsup: 3V

Operating at a nominal 3V ensures compatibility with standard digital systems.

Power Supplies (V): 3/3.3V

Dual voltage option allows flexibility in system design, accommodating various applications.

No. of Terminals: 56

A higher terminal count enables more features and connections, increasing versatility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile and small outline reduce space requirements, making it ideal for compact devices.

Alternate Memory Width: 8

Supports an 8-bit wide memory interface, providing flexibility in data handling.

Maximum Operating Temperature: 85 °C

Rated for high temperatures, suitable for industrial applications and demanding environments.

Organization: 2MX16

This organization format enhances data management and access efficiency.

Minimum Operating Temperature: -40 °C

Capable of operation in extreme cold, making it suitable for outdoor and industrial applications.

No. of Sectors/Size: 32

Multiple sectors allow for more efficient memory management and data segmentation.

Terminal Position: DUAL

Dual terminal position provides flexibility in mounting options and improves design adaptability.

Maximum Seated Height: 1.2 mm

Low height facilitates design in compact devices without compromising performance.

Width: 14 mm

A standard width that allows integration into various designs without complications.

Minimum Supply Voltage (Vsup): 2.7V

Low minimum voltage makes it easier to integrate into low-power systems.

Page Size (words): 4/8

Flexible page sizing offers adaptability for different data processing needs.

Type: NOR TYPE

NOR type offers fast read speeds and random access capabilities, enhancing performance.

Common Flash Interface: YES

A common interface standard ensures compatibility with a wide range of devices and systems.

Length: 18.4 mm

Compact length supports space-saving designs, which is critical in modern electronics.

Programming Voltage (V): 3V

Standard programming voltage simplifies integration with existing circuitry.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in challenging environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Parallel or Serial: PARALLEL

Parallel interface allows for faster data transfer rates, improving overall performance.

Terminal Form: GULL WING

Gull wing terminals provide good soldering reliability and ease of mounting.

Sector Size (Words): 128K

Large sector size improves data handling capabilities and performance.

Maximum Supply Current: 30 mA

Moderate current rating optimizes power consumption while ensuring performance.

No. of Words: 2097152 words

High word count indicates substantial data storage capability for complex applications.

Memory Width: 16

16-bit memory width allows efficient processing of data, enhancing throughput.

Terminal Pitch: 0.5 mm

Fine pitch aids in dense circuit designs, perfect for modern electronic applications.

No. of Words Code: 2M

Identification of memory capacity ensures suitability for storage-intensive applications.

Command User Interface: YES

User-friendly command interface enhances ease of use during development and integration.

Ready or Busy: YES

Ready/busy status signals streamline operations, ensuring efficient task management.

Maximum Supply Voltage (Vsup): 3.6V

Maximum supply voltage provides flexibility in power management systems.

Memory Density: 33554432 bit

High memory density facilitates storage of large data sets, suitable for advanced applications.

Memory IC Type: FLASH

Flash memory type allows non-volatile storage, retaining data without power.

Maximum Standby Current: 0.00004 Amp

Extremely low standby current enhances energy efficiency, making it eco-friendly.

Maximum Access Time: 110 ns

Fast access time ensures quick data retrieval, improving overall system responsiveness.

Technical Specifications

Flash Memory M58LW032D110N6 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

110 ns

Alternate Memory Width:

8

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e0

Length:

18.4 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

32

No. of Terminals:

56

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Page Size (words):

4/8

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

128K

Maximum Standby Current:

.00004 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Toggle Bit:

NO

Type:

NOR TYPE

Width:

14 mm

Trade Compliance

M58LW032D110N6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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