Loading...

M58LW064D110N6P

STMicroelectronics

M58LW064D110N6P by STMicroelectronics

STMicroelectronics M58LW064D110N6P is a 64Mb NOR Flash Memory with 4MX16 organization, operating at 3V. It features synchronous operation, industrial temperature grade, and parallel interface. Ideal for applications requiring fast access times and high memory density in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,868

-

-

-

-

Anansix

USA . 2,074 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,074

-

-

-

-

Vyrian

USA . 1,502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,502

-

-

-

-

Nova Conductors

Japan . 86 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

86

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 269 parts In-Stock

1+ parts

$4.396

100+ parts

-

1k+ parts

$3.956

10k+ parts

-

269

$4.396

-

$3.956

-

AZTECH Wire

Italy . 557 parts In-Stock

1+ parts

$7.147

100+ parts

-

1k+ parts

-

10k+ parts

-

557

$7.147

-

-

-

MKK Technologies

India . 615 parts In-Stock

1+ parts

$8.266

100+ parts

-

1k+ parts

-

10k+ parts

-

615

$8.266

-

-

-

DigiPath Technology Company

USA . 615 parts In-Stock

1+ parts

$8.266

100+ parts

-

1k+ parts

-

10k+ parts

-

615

$8.266

-

-

-

Ampacity Inc.

Singapore . 431 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

431

$28.000

-

-

-

Continental Prestige Electronics

USA . 6,057 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,057

-

-

-

-

Corphita

USA . 4,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,180

-

-

-

-

Argo Parts USA

USA . 2,838 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,838

-

-

-

-

Parana Technologies

USA . 1,321 parts In-Stock

1+ parts

-

100+ parts

$5.256

1k+ parts

-

10k+ parts

-

1,321

-

$5.256

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Unlock limitless possibilities with the M58LW064D110N6P by STMicroelectronics, a top-quality Flash Memory chip that guarantees superior performance and reliability. Designed by industry leader STMicroelectronics, this cutting-edge product is perfect for a wide range of applications, from consumer electronics to industrial automation. Offering unmatched value and benefits, this memory chip provides seamless operation and lightning-fast access times, ensuring your devices run smoothly and efficiently. Upgrade your technology with the M58LW064D110N6P and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard board layouts, making integration seamless.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transferred at a consistent and reliable rate, improving overall performance.

Nominal Supply Voltage: 3V

The nominal supply voltage of 3V is ideal for a wide range of applications, providing flexibility and compatibility.

No. of Terminals: 56

With 56 terminals, this product offers sufficient connectivity options for versatile use in various systems.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design make this product space-saving and suitable for compact devices.

Alternate Memory Width: 8

The alternate memory width of 8 bits allows for efficient data storage and retrieval, enhancing overall system performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions.

Organization: 4MX16

The 4MX16 organization provides ample storage capacity for data-intensive applications, making it a reliable choice for memory storage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments.

Terminal Position: DUAL

The dual terminal position offers flexibility in connection options, accommodating various circuit board layouts.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm is suitable for thin devices, allowing for compact designs.

Width: 14 mm

With a width of 14 mm, this product is compact and space-efficient, ideal for devices with limited space.

Minimum Supply Voltage: 2.7V

The minimum supply voltage of 2.7V ensures compatibility with low-power applications, extending battery life.

Type: NOR TYPE

The NOR type memory technology offers fast read speeds and random access, making it suitable for high-performance applications.

Length: 18.4 mm

The length of 18.4 mm is compact and suitable for devices with limited board space.

Programming Voltage: 3V

The programming voltage of 3V simplifies the operation and integration process, ensuring ease of use.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding environments, making this product a robust choice.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, making it energy-efficient and suitable for battery-powered devices.

Parallel or Serial: PARALLEL

The parallel data transfer mode provides fast and efficient communication between the memory and the processor, enhancing system performance.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and easy installation, ensuring a reliable electrical connection.

No. of Words: 4194304 words

With a high number of words, this product offers ample storage capacity for large data sets, suitable for data-intensive applications.

Memory Width: 16

The memory width of 16 bits allows for efficient data storage and retrieval, enhancing overall system performance.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm provides compatibility with standard board layouts, making installation easy and straightforward.

No. of Words Code: 4M

The 4M words code ensures compatibility with various systems and applications, making this product versatile and widely applicable.

Maximum Supply Voltage: 3.6V

With a maximum supply voltage of 3.6V, this product ensures compatibility with a wide range of power sources, providing flexibility in system design.

Memory Density: 67108864 bit

The high memory density of 67108864 bits offers ample storage capacity for large data sets, making this product ideal for memory-intensive applications.

Memory IC Type: FLASH

The FLASH memory IC type ensures fast read and write speeds, making it suitable for high-speed data storage and retrieval applications.

Maximum Access Time: 110 ns

With a maximum access time of 110 nanoseconds, this product offers fast data access speeds, ensuring efficient performance in time-sensitive applications.

Technical Specifications

Flash Memory M58LW064D110N6P attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

110 ns

Alternate Memory Width:

8

JESD-30 Code:

R-PDSO-G56

Length:

18.4 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

56

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

14 mm

Trade Compliance

M58LW064D110N6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20