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S25FL256SAGMFIR00

Infineon Technologies

S25FL256SAGMFIR00 by Infineon Technologies

The Infineon Technologies S25FL256SAGMFIR00 is a NOR type flash memory with 64Mx4 organization, 133 MHz clock frequency, and SPI serial bus. It operates at -40 to 85 °C with 100000 write/erase cycles endurance. Ideal for industrial applications requiring high-speed synchronous operation in compact designs.

Median Price

$3.372

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 740 parts In-Stock

1+ parts

$3.360

100+ parts

-

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740

$3.360

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Arrow

USA . 393 parts In-Stock

1+ parts

$3.372

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-

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393

$3.372

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Mouser Electronics

USA . 754 parts In-Stock

1+ parts

$4.960

100+ parts

$4.160

1k+ parts

$3.990

10k+ parts

$3.920

754

$4.960

$4.160

$3.990

$3.920

DigiKey

USA . 655 parts In-Stock

1+ parts

$4.960

100+ parts

$4.385

1k+ parts

$3.988

10k+ parts

$3.914

655

$4.960

$4.385

$3.988

$3.914

Flip Electronics (Authorized)

USA . 26,200 parts In-Stock

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26,200

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Rochester

USA . 2,280 parts In-Stock

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$2.750

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$2.460

10k+ parts

$2.310

2,280

-

$2.750

$2.460

$2.310

Verical

USA . 393 parts In-Stock

1+ parts

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393

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Distributors (In-Stock)

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Digiode

USA . 303 parts In-Stock

1+ parts

$3.743

100+ parts

-

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303

$3.743

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Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$5.372

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86

$5.372

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Flip Electronics

USA . 25,815 parts In-Stock

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Vyrian

USA . 4,359 parts In-Stock

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4,359

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 2,930 parts In-Stock

1+ parts

$2.216

100+ parts

$2.127

1k+ parts

$2.039

10k+ parts

-

2,930

$2.216

$2.127

$2.039

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Corohmni

South Africa . 30 parts In-Stock

1+ parts

$2.692

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30

$2.692

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Semicontronic

India . 4,118 parts In-Stock

1+ parts

$3.230

100+ parts

$3.149

1k+ parts

$3.133

10k+ parts

-

4,118

$3.230

$3.149

$3.133

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Corphita

USA . 557 parts In-Stock

1+ parts

$3.546

100+ parts

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557

$3.546

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Component Stockers USA

USA . 4,661 parts In-Stock

1+ parts

$4.110

100+ parts

$3.870

1k+ parts

$3.820

10k+ parts

-

4,661

$4.110

$3.870

$3.820

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Aztec Data Supply Inc.

USA . 59 parts In-Stock

1+ parts

$5.057

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59

$5.057

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$5.281

100+ parts

$5.017

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$5.017

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70

$5.281

$5.017

$5.017

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Continental Prestige Electronics

USA . 6,569 parts In-Stock

1+ parts

$5.372

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$5.265

6,569

$5.372

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$5.265

Netroflash

USA . 100 parts In-Stock

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$5.372

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100

$5.372

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QUARKTWIN TECHNOLOGY LTD

USA . 25,900 parts In-Stock

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25,900

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Argo Parts USA

USA . 3,728 parts In-Stock

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Perfect Parts

USA . 1,440 parts In-Stock

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Futuretech Components

Singapore . 1,228 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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300

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Kepictronics

USA . 47 parts In-Stock

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47

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Overview

Discover the Infineon Technologies S25FL256SAGMFIR00 Flash Memory, a top-tier product that combines unparalleled quality and reliability. With Infineon's reputation as a leading manufacturer in the industry, this flash memory offers exceptional performance and versatility for a variety of applications. Experience the value of seamless operation, high-speed data transfers, and secure data storage with this innovative product. Upgrade your devices with the Infineon S25FL256SAGMFIR00 Flash Memory and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the flash memory chip, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and communication with the memory, enhancing performance and reliability.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this flash memory chip suitable for a wide range of electronic devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making this flash memory chip ideal for compact designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this flash memory chip can withstand high temperature environments, offering reliability in various conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making this flash memory chip energy-efficient and fast.

Memory IC Type: FLASH

Being a flash memory chip, it offers non-volatile storage capabilities, allowing data to be retained even when power is lost, making it suitable for various applications.

Technical Specifications

Flash Memory S25FL256SAGMFIR00 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Additional Features:

IT ALSO CONFIGURED AS 256M X 1

Alternate Memory Width:

2

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

7.5 mm

Maximum Write Cycle Time (tWC):

500 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL256SAGMFIR00 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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