Loading...

M58LR128FB85ZB6F

STMicroelectronics

M58LR128FB85ZB6F by STMicroelectronics

M58LR128FB85ZB6F from STMicroelectronics is a NOR flash memory with a 1.8V supply, featuring 8M words of storage and an access time of 85 ns. It operates in asynchronous mode and supports industrial applications with a temp range of -40 °C to 85 °C. Its compact design (7.7mm x 9mm) makes it ideal for space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,141

-

-

-

-

Digiode

USA . 5,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,720

-

-

-

-

Anansix

USA . 2,579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,579

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 22 parts In-Stock

1+ parts

$3.057

100+ parts

-

1k+ parts

$2.751

10k+ parts

-

22

$3.057

-

$2.751

-

MKK Technologies

India . 1,804 parts In-Stock

1+ parts

$5.749

100+ parts

-

1k+ parts

-

10k+ parts

-

1,804

$5.749

-

-

-

DigiPath Technology Company

USA . 1,804 parts In-Stock

1+ parts

$5.749

100+ parts

-

1k+ parts

-

10k+ parts

-

1,804

$5.749

-

-

-

Corphita

USA . 6,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,851

-

-

-

-

Parana Technologies

USA . 1,194 parts In-Stock

1+ parts

-

100+ parts

$3.655

1k+ parts

-

10k+ parts

-

1,194

-

$3.655

-

-

Overview

Unlock the power of innovation with the M58LR128FB85ZB6F flash memory from STMicroelectronics! Crafted with precision and a commitment to quality, this versatile memory solution excels in demanding industrial applications. Its low power consumption, robust temperature range, and efficient performance ensure reliability in critical systems. Elevate your designs with a trusted name that delivers unmatched reliability, empowering you to push the boundaries of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and resistance to environmental factors, ensuring reliability in varied applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into different electronic devices.

Package Shape: RECTANGULAR

A rectangular shape is conducive for efficient space utilization on circuit boards.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enhances performance by allowing simultaneous data access and improves speed in communication.

Nominal Supply Voltage / Vsup (V): 1.8

A low nominal supply voltage of 1.8V supports energy efficiency and is suitable for battery-operated devices.

Power Supplies (V): 1.8

Operating at a low voltage minimizes power consumption, contributing to longer battery life in portable applications.

No. of Terminals: 56

A higher number of terminals enhances connectivity options, facilitating better integration in complex systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and thin profile design optimize space, making it excellent for compact electronic products.

Maximum Operating Temperature: 85 °C

With a maximum temperature of 85 °C, this product is suitable for industrial applications that may experience higher thermal conditions.

Organization: 8MX16

The 8M x 16 organization increases memory density, providing significant storage capacity within a compact size.

Minimum Operating Temperature: -40 °C

This product is designed to perform in extreme temperatures, ensuring reliability in harsh environments.

No. of Sectors/Size: 4,127

A large number of sectors allows for efficient data management and organization, supporting complex applications.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish provides excellent corrosion resistance and enhances solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for effective board design and integration, especially in space-constrained environments.

Maximum Seated Height: 1 mm

A low seated height supports ultra-thin device designs, ideal for modern sleek electronics.

Width: 7.7 mm

The compact width allows for versatile placement on PCBs, maximizing layout efficiency.

Minimum Supply Voltage (Vsup): 1.7 V

Operating at a minimum supply voltage of 1.7V enhances compatibility with various low-power systems.

Page Size (words): 4

A smaller page size benefits applications requiring rapid and frequent updates to data.

Type: NOR TYPE

NOR type technology supports fast read speeds, making it suitable for applications where quick data access is essential.

Common Flash Interface: YES

A common flash interface simplifies integration with existing systems, enhancing usability and compatibility.

Length: 9 mm

Compact length further optimizes PCB real estate, particularly useful in tightly packed electronic designs.

Programming Voltage (V): 1.8

A low programming voltage contributes to the overall energy efficiency of the product, making it environmentally friendly.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerances signify reliability in rigorous environments and industrial applications.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, which is key for modern electronic applications.

Parallel or Serial: PARALLEL

Parallel data access allows for faster data transfers, making it suitable for high-speed applications.

Terminal Form: BALL

Ball terminal configuration enhances soldering precision and reliability during assembly.

Sector Size (Words): 16K,64K

Varied sector sizes provide flexibility in memory allocation, catering to different application requirements.

Maximum Supply Current: 47 mA

Moderate supply current consumption balances between performance and energy efficiency in device operation.

No. of Words: 8388608 words

With over 8 million words, this memory provides ample storage for extensive data, suitable for complex applications.

Memory Width: 16

A wider memory width allows for more data to be processed simultaneously, enhancing throughput efficiency.

Terminal Pitch: 0.75 mm

A smaller terminal pitch allows for compact placement of the memory chip, suitable for high-density PCB layouts.

No. of Words Code: 8M

An 8M word code signifies substantial data capacity, making it ideal for large-scale applications.

Command User Interface: YES

A command user interface simplifies interaction and control, improving usability for developers and integrators.

Maximum Supply Voltage (Vsup): 2 V

A maximum supply voltage of 2V ensures compatibility with low-voltage circuits for modern electronic devices.

Boot Block: BOTTOM

A bottom boot block structure allows for fast access to boot firmware, enhancing system startup times.

Memory Density: 134217728 bit

High memory density supports vast data storage capabilities, making it suitable for memory-intensive applications.

Memory IC Type: FLASH

As a flash memory IC, it provides non-volatile storage, ideal for retaining information without power.

Maximum Standby Current: 0.000005 Amp

Extremely low standby current consumption enhances battery life and efficiency in portable applications.

Maximum Access Time: 85 ns

With a fast access time of 85 ns, this memory enables quick data retrieval, crucial for high-performance applications.

Technical Specifications

Flash Memory M58LR128FB85ZB6F attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

85 ns

Additional Features:

SYNCHRONOUS BURST MODE OPERATION POSSIBLE

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

9 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

4,127

No. of Terminals:

56

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,7X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Page Size (words):

4

Parallel or Serial:

PARALLEL

Power Supplies (V):

1.8

Programming Voltage (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sector Size (Words):

16K,64K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

47 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Toggle Bit:

NO

Type:

NOR TYPE

Width:

7.7 mm

Trade Compliance

M58LR128FB85ZB6F Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20