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74LX1G07CTR

STMicroelectronics

74LX1G07CTR by STMicroelectronics

STMicroelectronics 74LX1G07CTR is a CMOS Logic Gate with 5 terminals, operating voltage range of 1.65V to 5.5V, and max I (ol) of 24A. It features open-drain output characteristics, propagation delay of 8.3ns, and industrial temperature grade suitability for various applications in electronics circuits.

Median Price

$0.340

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$0.340

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500

$0.340

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Vyrian

USA . 5,707 parts In-Stock

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5,707

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First Choice Components Inc.

USA . 4,593 parts In-Stock

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4,593

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Digiode

USA . 3,043 parts In-Stock

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3,043

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J2 Sourcing AB

Sweden . 2,000 parts In-Stock

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2,000

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VNN

France . 776 parts In-Stock

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776

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Anansix

USA . 242 parts In-Stock

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NPI Materials, Inc.

USA . 44 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$0.333

100+ parts

-

1k+ parts

$0.320

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100

$0.333

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$0.320

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AZTECH Wire

Italy . 456 parts In-Stock

1+ parts

$9.144

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456

$9.144

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Microchip USA

USA . 129 parts In-Stock

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$15.842

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129

$15.842

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Corohmni

South Africa . 173 parts In-Stock

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$19.979

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$19.979

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Advanced Electronics

New Zealand . 17 parts In-Stock

1+ parts

$28.391

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$25.836

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$23.281

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17

$28.391

$25.836

$23.281

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IDEA Electronic Components Group

UK . 1,501 parts In-Stock

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$29.047

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$26.142

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$29.047

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MKK Technologies

India . 2,240 parts In-Stock

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$54.621

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$54.621

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DigiPath Technology Company

USA . 2,240 parts In-Stock

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$54.621

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$54.621

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Ampacity Inc.

Singapore . 1,467 parts In-Stock

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$62.000

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Perfect Parts

USA . 23,288 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,099 parts In-Stock

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Corphita

USA . 2,047 parts In-Stock

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2,047

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Parana Technologies

USA . 1,931 parts In-Stock

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$34.730

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1,931

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$34.730

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Lixinc

USA . 1,478 parts In-Stock

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1,478

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Overview

Unlock endless possibilities with the 74LX1G07CTR by STMicroelectronics, a high-quality logic gate that delivers unparalleled performance and reliability. Manufactured by a trusted industry leader, this product is perfect for a wide range of applications. Its compact design and advanced technology make it ideal for industrial use. Experience seamless operation and enhanced efficiency with this versatile component. Elevate your projects to new heights with the 74LX1G07CTR - the ultimate solution for all your logic gate needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the internal components of the logic gates, making it ideal for long-term use.

Surface Mount: YES

Being surface mountable makes the logic gates easy to integrate into circuit boards, allowing for efficient and space-saving designs.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V helps in reducing power consumption and heat generation, making the logic gates energy-efficient.

Propagation Delay (tpd): 8.3 ns

The low propagation delay ensures fast operation, making the logic gates suitable for high-speed applications.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics allow for easily interfacing with other components, enhancing the versatility of the logic gates.

Technology: CMOS

The CMOS technology used in the logic gates ensures low power consumption and high noise immunity, making them reliable for various digital applications.

Technical Specifications

Logic Gates 74LX1G07CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Additional Features:

DUMMY VAL

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay (tpd):

8.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LX1G07CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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