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74LX1G00CTR

STMicroelectronics

74LX1G00CTR by STMicroelectronics

74LX1G00CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 5.2 ns and operates at supply voltages from 1.65V to 5.5V. It features dual inputs and is ideal for high-speed applications in compact designs. Its military-grade specs ensure reliability in extreme temperatures (-55 °C to 125 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,920 parts In-Stock

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6,920

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Digiode

USA . 578 parts In-Stock

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578

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Anansix

USA . 132 parts In-Stock

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132

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Distributors (Availability)

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Microchip USA

USA . 318 parts In-Stock

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$7.377

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318

$7.377

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AZTECH Wire

Italy . 947 parts In-Stock

1+ parts

$8.220

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947

$8.220

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IDEA Electronic Components Group

UK . 2,113 parts In-Stock

1+ parts

$20.682

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$18.613

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2,113

$20.682

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$18.613

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Native Components

USA . 858 parts In-Stock

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$22.720

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858

$22.720

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Northwest PG Solutions

USA . 212 parts In-Stock

1+ parts

$24.992

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$22.493

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212

$24.992

$22.493

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Ampacity Inc.

Singapore . 1,109 parts In-Stock

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$37.000

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$37.000

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MKK Technologies

India . 1,634 parts In-Stock

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$38.890

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1,634

$38.890

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DigiPath Technology Company

USA . 1,634 parts In-Stock

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$38.890

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1,634

$38.890

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Perfect Parts

USA . 15,505 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,463 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Corphita

USA . 2,947 parts In-Stock

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Parana Technologies

USA . 1,669 parts In-Stock

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$24.728

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$24.728

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Assy Fe

Spain . 1,000 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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$19.239

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$17.815

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$17.815

250

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$19.239

$17.815

$17.815

Overview

Unleash the power of precision with the 74LX1G00CTR logic gate from STMicroelectronics! Crafted for reliability and performance, this compact component excels in fast, efficient signal processing, making it ideal for automotive, industrial, and consumer applications. With a wide operating temperature range and low power consumption, it ensures longevity and stability in demanding environments. Elevate your designs with quality you can trust—choose STMicroelectronics for unparalleled innovation and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and lightweight characteristics, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 5.2 ns

A low propagation delay at nominal supply voltage allows for faster signal processing, which is ideal for high-speed applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern PCB designs, promoting space-saving and efficient layouts.

No. of Inputs: 2

Having two inputs provides flexibility for logic operations, making it versatile for both simple and complex circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier routing and placement on printed circuit boards.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage reduces overall power consumption, making it energy-efficient for battery-operated devices.

Load Capacitance (CL): 50 pF

A low load capacitance allows for quicker switching times, enhancing the performance and efficiency of circuits.

Power Supplies (V): 3.3

Compatible with standard 3.3V power supplies, it ensures easy integration into a wide range of electronic systems.

No. of Terminals: 5

With five terminals, this logic gate ensures versatile connection options, allowing for flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch of the package style enable high-density mounting on circuit boards, maximizing space utilization.

Maximum I (ol): 24 Amp

A high maximum output current rating allows this logic gate to drive larger loads, making it suitable for robust applications.

Propagation Delay (tpd): 13 ns

The propagation delay allows for quick response times in signal processing, crucial for high-speed logic applications.

Maximum Operating Temperature: 125 °C

A wide maximum operating temperature ensures reliability and stable performance in harsh environments and conditions.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, it is suitable for applications in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance, enhancing the longevity of connections.

Terminal Position: DUAL

The dual terminal position design accommodates various layout configurations for optimal circuit design flexibility.

Maximum Seated Height: 1.1 mm

A low maximum seated height allows for low-profile designs, making it suitable for compact electronic assemblies.

Width: 1.25 mm

A narrow width enhances design density, allowing more components to fit within a small footprint.

Minimum Supply Voltage (Vsup): 1.65 V

The minimum supply voltage is low enough to support a variety of modern digital circuits that prioritize power savings.

Length: 2 mm

The small length dimension allows for high-density packaging, critical for space-constrained applications.

Temperature Grade: MILITARY

With a military temperature grade, this product meets rigorous standards, ensuring reliability under extreme conditions.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high speed, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form enhances mechanical stability and improves solderability, providing durable connections.

Packing Method: TR

The TR packing method enhances ease of handling and integration into automated assembly processes.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for tighter placement of components on a board, maximizing available space.

Maximum Supply Voltage (Vsup): 5.5 V

A high maximum supply voltage allows compatibility with various power levels, enhancing its usability across different applications.

Technical Specifications

Logic Gates 74LX1G00CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LX1G00CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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