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74LX1G07STR

STMicroelectronics

74LX1G07STR by STMicroelectronics

74LX1G07STR by STMicroelectronics is a CMOS logic gate with an open-drain output, ideal for low-voltage applications. It operates b/w 1.65V and 5.5V, features a max I(ol) of 24A, and has a fast propagation delay of just 8.3 ns. Its compact design suits industrial environments with temp ranges from -40 °C to 85°C.

Median Price

$0.026

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

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$0.020

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$0.020

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Chip1Stop

Japan . 2 parts In-Stock

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$0.031

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Digiode

USA . 1,621 parts In-Stock

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$0.019

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$0.019

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ComSIT Distribution GmbH

Germany . 42,000 parts In-Stock

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Vyrian

USA . 3,947 parts In-Stock

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Anansix

USA . 1,204 parts In-Stock

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First Choice Components Inc.

USA . 151 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,299 parts In-Stock

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$0.018

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4,299

$0.018

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Component Stockers USA

USA . 1 parts In-Stock

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$0.020

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1

$0.020

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Corohmni

South Africa . 25 parts In-Stock

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$0.042

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25

$0.042

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Microchip USA

USA . 344 parts In-Stock

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$5.198

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344

$5.198

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AZTECH Wire

Italy . 695 parts In-Stock

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$12.450

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695

$12.450

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Native Components

USA . 517 parts In-Stock

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$12.715

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$12.715

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Northwest PG Solutions

USA . 587 parts In-Stock

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$13.987

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$12.588

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$13.987

$12.588

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IDEA Electronic Components Group

UK . 163 parts In-Stock

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$14.285

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$12.856

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163

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Advanced Electronics

New Zealand . 750 parts In-Stock

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$21.469

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$19.537

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$17.605

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750

$21.469

$19.537

$17.605

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MKK Technologies

India . 915 parts In-Stock

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$26.862

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915

$26.862

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DigiPath Technology Company

USA . 915 parts In-Stock

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$26.862

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915

$26.862

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QUARKTWIN TECHNOLOGY LTD

USA . 8,113 parts In-Stock

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Perfect Parts

USA . 4,835 parts In-Stock

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Parana Technologies

USA . 1,909 parts In-Stock

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$17.080

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$17.080

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Metaverse IC Inc.

Canada . 668 parts In-Stock

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Kepictronics

USA . 528 parts In-Stock

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Overview

Discover the exceptional reliability of the 74LX1G07STR from STMicroelectronics, a leading innovator in semiconductor solutions. This high-performance logic gate delivers outstanding efficiency for a wide range of applications, from consumer electronics to industrial automation. Designed with a compact footprint and optimized for low power consumption, it ensures seamless integration and enhanced functionality, offering customers unmatched value and performance in today's fast-paced technology landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capabilities allow for easy integration into modern circuit designs, providing flexibility and saving board space.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and packing density on PCBs, making it efficient for space-constrained designs.

Nominal Supply Voltage / Vsup: 1.8 V

A low nominal supply voltage of 1.8 V ensures low power consumption, making it suitable for battery-powered and energy-efficient applications.

Power Supplies (V): 3.3 V

Compatibility with a standard power supply voltage of 3.3 V allows for easy integration with common digital systems.

No. of Terminals: 5

The 5-terminal design is optimal for various logic configurations while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

A small outline with a low profile helps save space in compact designs, which is ideal for consumer electronics and portable devices.

Maximum I (ol): 24 Amp

A high output current capability of 24 A supports demanding applications, offering robustness in load-driving scenarios.

Propagation Delay (tpd): 8.3 ns

Fast propagation delay of 8.3 ns enables high-speed data transmission, making it suitable for high-frequency applications.

Maximum Operating Temperature: 85 °C

An extended operating temperature range ensures reliability in diverse operating environments, crucial for industrial applications.

Output Characteristics: OPEN-DRAIN

Open-drain output characteristics provide versatility in interfacing with other logic families and enable wired-AND configurations.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this component suitable for applications in harsh and extreme temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes ensure excellent solderability and reliable electrical connections, enhancing longevity.

Terminal Position: DUAL

Dual terminal position allows for effective layout options on circuit boards, providing design flexibility.

Maximum Seated Height: 1.45 mm

A low seated height contributes to a slim profile, essential for compact electronic assemblies in modern devices.

Width: 1.625 mm

A narrow width facilitates dense packing on PCBs, allowing for smaller form factor designs.

Minimum Supply Voltage (Vsup): 1.65 V

A low minimum supply voltage of 1.65 V supports flexibility in power supply design, enhancing compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

Robust reflow characteristics simplify assembly processes while ensuring component integrity during soldering.

Peak Reflow Temperature °C: 260 °C

A high peak reflow temperature compatibility ensures the component can withstand standard soldering processes used in manufacturing.

Length: 2.9 mm

A compact length allows for space-efficient designs, making it ideal for compact electronic products.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications guarantee reliability and longevity in critical applications, enhancing product performance.

Technology: CMOS

CMOS technology provides lower power consumption and higher noise immunity, making this product efficient and reliable for digital circuits.

Terminal Form: GULL WING

Gull wing terminals facilitate ease of soldering and ensure mechanical stability, critical for robust electronic assemblies.

Packing Method: TR

Tape and reel packing method allows for efficient automated assembly processes, improving production efficiency.

Terminal Pitch: 0.95 mm

A 0.95 mm terminal pitch optimizes space utilization on PCBs, enabling the design of compact, high-density layouts.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides compatibility with a wide range of digital systems, enhancing versatility in application.

Technical Specifications

Logic Gates 74LX1G07STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Additional Features:

DUMMY VAL

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

8.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74LX1G07STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-627-5832, 5962016275832

NIIN

016275832

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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