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74LX1G04BJR

STMicroelectronics

74LX1G04BJR by STMicroelectronics

74LX1G04BJR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 6.5 ns, operating b/w 1.65V and 5.5V. It features a compact design with a very thin profile and supports military-grade temperatures from -55 °C to 125 °C. Ideal for high-speed applications in space-constrained environments, it ensures reliable performance in critical systems.

Median Price

$2.630

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7,406 parts In-Stock

1+ parts

$2.630

100+ parts

$1.608

1k+ parts

$1.423

10k+ parts

$1.377

7,406

$2.630

$1.608

$1.423

$1.377

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 237 parts In-Stock

1+ parts

$2.498

100+ parts

-

1k+ parts

-

10k+ parts

-

237

$2.498

-

-

-

Vyrian

USA . 2,190 parts In-Stock

1+ parts

$2.680

100+ parts

-

1k+ parts

-

10k+ parts

-

2,190

$2.680

-

-

-

Anansix

USA . 2,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,222

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,769 parts In-Stock

1+ parts

$2.367

100+ parts

-

1k+ parts

-

10k+ parts

-

2,769

$2.367

-

-

-

Microchip USA

USA . 313 parts In-Stock

1+ parts

$2.842

100+ parts

-

1k+ parts

-

10k+ parts

-

313

$2.842

-

-

-

IDEA Electronic Components Group

UK . 803 parts In-Stock

1+ parts

$14.915

100+ parts

-

1k+ parts

$13.424

10k+ parts

-

803

$14.915

-

$13.424

-

MKK Technologies

India . 2,226 parts In-Stock

1+ parts

$28.047

100+ parts

-

1k+ parts

-

10k+ parts

-

2,226

$28.047

-

-

-

DigiPath Technology Company

USA . 2,226 parts In-Stock

1+ parts

$28.047

100+ parts

-

1k+ parts

-

10k+ parts

-

2,226

$28.047

-

-

-

Native Components

USA . 984 parts In-Stock

1+ parts

$74.665

100+ parts

-

1k+ parts

-

10k+ parts

$71.678

984

$74.665

-

-

$71.678

Northwest PG Solutions

USA . 192 parts In-Stock

1+ parts

$82.132

100+ parts

-

1k+ parts

-

10k+ parts

-

192

$82.132

-

-

-

Perfect Parts

USA . 20,848 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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20,848

-

-

-

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,500

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,852

-

-

-

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GreenTree Electronics

Israel . 4,063 parts In-Stock

1+ parts

-

100+ parts

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4,063

-

-

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Parana Technologies

USA . 1,191 parts In-Stock

1+ parts

-

100+ parts

$17.833

1k+ parts

-

10k+ parts

-

1,191

-

$17.833

-

-

Overview

Unlock the power of precision with the 74LX1G04BJR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This ultra-reliable logic gate excels in high-performance applications while delivering exceptional speed and efficiency. With its compact design, it fits seamlessly into modern electronic circuits, enhancing device functionality without compromising space. Experience superior quality and robust performance that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and helps protect the internal components from environmental factors.

Propagation Delay At Nominal Supply: 6.5 ns

With a low propagation delay, this product can operate quickly, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards.

Package Shape: SQUARE

The square package shape optimizes space utilization on the circuit board, allowing for denser layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Working at a nominal supply voltage of 1.8V contributes to power efficiency, making it suitable for low-power applications.

Load Capacitance (CL): 50 pF

The load capacitance specification allows compatibility with a wide range of circuits, ensuring stable performance.

Power Supplies (V): 3.3

Designed to operate on a 3.3V supply, this component is well-suited for most modern digital circuits.

No. of Terminals: 4

The compact 4-terminal configuration simplifies the design and makes it easier to implement in applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch grid array style enable high-density mounting in space-constrained applications.

Maximum I (ol): 24 Amp

With a maximum output current rating of 24 Amps, this product can drive heavy loads, making it versatile for various uses.

Propagation Delay (tpd): 11.5 ns

A favorable propagation delay ensures fast switching times, enhancing the overall performance of digital circuits.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, this product is suitable for demanding environments where heat is a concern.

Minimum Operating Temperature: -55 °C

The ability to function at very low temperatures makes this component ideal for applications in extreme conditions.

Terminal Finish: TIN SILVER COPPER

Tin-silver-copper terminal finish provides excellent solderability and reliability in connection, ensuring long-lasting performance.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient space usage on PCBs and ease of assembly in blind vias.

Maximum Seated Height: 0.715 mm

A low seated height minimizes the profile of the device, which is perfect for compact devices and systems.

Width: 1.07 mm

The narrow width allows for space-efficient designs without compromising functionality.

Minimum Supply Voltage (Vsup): 1.65 V

Supports a minimum supply voltage of 1.65V, enhancing compatibility with various low-voltage circuits.

Length: 1.07 mm

The compact length supports design flexibility in both consumer and industrial applications.

Temperature Grade: MILITARY

Designed for military-grade applications, ensuring high reliability and performance in harsh environments.

Technology: CMOS

Utilizing CMOS technology, this product provides low power consumption along with high-speed performance.

Terminal Form: BALL

Ball terminal form facilitates improved connectivity and makes it easier to solder, enhancing assembly efficiency.

Packing Method: TR

The tape and reel packing method enables automated assembly processes, streamlining production.

Terminal Pitch: 0.5 mm

With a fine terminal pitch, this product supports high density in PCB designs while maintaining reliable connections.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum voltage rating of 5.5V provides flexibility for a range of applications while ensuring safe operation.

Technical Specifications

Logic Gates 74LX1G04BJR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Length:

1.07 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.715 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.07 mm

Trade Compliance

74LX1G04BJR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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