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SN74LVC3G17DCURE4

Texas Instruments

SN74LVC3G17DCURE4 by Texas Instruments

SN74LVC3G17DCURE4 by Texas Instruments is a CMOS logic gate with 3 functions, featuring a propagation delay of 5.4 ns at 1.8V supply voltage. This Schmitt Trigger operates in automotive temperature grades and has a max operating temperature of 125°C, making it suitable for high-performance applications requiring fast response times. With a compact package style and surface-mount capability, this device is ideal for space-constrained designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,652 parts In-Stock

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4,652

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Digiode

USA . 4,392 parts In-Stock

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4,392

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Parana Technologies

USA . 635 parts In-Stock

1+ parts

$10.515

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$11.026

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635

$10.515

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$11.026

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DigiPath Technology Company

USA . 1,860 parts In-Stock

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$11.579

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1,860

$11.579

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ChromeModa Solutions

Germany . 5,273 parts In-Stock

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$11.815

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$9.688

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5,273

$11.815

$9.688

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IDEA Electronic Components Group

UK . 1,190 parts In-Stock

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$11.815

100+ parts

$11.224

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$10.634

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1,190

$11.815

$11.224

$10.634

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AZTECH Wire

Italy . 892 parts In-Stock

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$14.384

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892

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$19.220

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$18.259

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$18.259

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$19.220

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$18.259

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Corohmni

South Africa . 474 parts In-Stock

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$19.256

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$19.256

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Ampacity Inc.

Singapore . 1,403 parts In-Stock

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$38.000

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$38.000

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Semicontronic

India . 1,623 parts In-Stock

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$41.000

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$39.975

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$39.770

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1,623

$41.000

$39.975

$39.770

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One Stop Electronics

USA . 1,439 parts In-Stock

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$47.000

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Continental Prestige Electronics

USA . 5,417 parts In-Stock

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Corphita

USA . 1,647 parts In-Stock

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Microchip USA

USA . 1,487 parts In-Stock

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Argo Parts USA

USA . 1,203 parts In-Stock

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Modulus Dynamics

Lithuania . 500 parts In-Stock

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500

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Bastille Electronics

Australia . 100 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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Overview

Elevate your electronic designs with the SN74LVC3G17DCURE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This logic gate offers fast propagation delay, low power consumption, and versatile applications. With its compact package and high performance, this product is perfect for automotive and industrial applications. Upgrade your projects with the value and precision that Texas Instruments provides.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the components inside the logic gates.

Propagation Delay At Nominal Supply: 5.4 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and minimizing assembly time.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage of 1.8V, making it energy-efficient and suitable for low-power applications.

Power Supplies (V): 3.3

Supports a power supply of 3.3V, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions.

Schmitt Trigger: YES

Includes a Schmitt trigger for hysteresis, providing noise immunity and stable output signals in noisy environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high noise immunity, and compatibility with a wide range of devices and systems.

Technical Specifications

Logic Gates SN74LVC3G17DCURE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

9.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

SN74LVC3G17DCURE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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