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SN74LVC1G0832YZPR

Texas Instruments

SN74LVC1G0832YZPR by Texas Instruments

SN74LVC1G0832YZPR by Texas Instruments is a logic gate with 3 inputs and 6 terminals. It has a propagation delay of 5.9 ns at 1.8V, making it suitable for high-speed applications. With a max operating temperature of 85°C, it is ideal for industrial environments requiring fast signal processing.

Median Price

$0.360

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 80,500 parts In-Stock

1+ parts

$0.439

100+ parts

$0.298

1k+ parts

$0.153

10k+ parts

-

80,500

$0.439

$0.298

$0.153

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Mouser Electronics

USA . 2,822 parts In-Stock

1+ parts

$0.590

100+ parts

$0.329

1k+ parts

$0.285

10k+ parts

$0.259

2,822

$0.590

$0.329

$0.285

$0.259

Rochester

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

$0.287

1k+ parts

$0.238

10k+ parts

$0.212

54,000

-

$0.287

$0.238

$0.212

DigiKey

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.360

10k+ parts

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54,000

-

-

$0.360

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Verical

USA . 33,000 parts In-Stock

1+ parts

-

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$0.265

33,000

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$0.265

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 707 parts In-Stock

1+ parts

$0.201

100+ parts

-

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-

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707

$0.201

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.235

100+ parts

-

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500

$0.235

-

-

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DigiKey Marketplace

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.220

10k+ parts

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60,000

-

-

$0.220

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Vyrian

USA . 36,061 parts In-Stock

1+ parts

-

100+ parts

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36,061

-

-

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Prism Electronics

USA . 9,559 parts In-Stock

1+ parts

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9,559

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Netsource Technology, Inc.

USA . 2,068 parts In-Stock

1+ parts

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2,068

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Sunrise Surplus Inc.

USA . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 36,278 parts In-Stock

1+ parts

$0.180

100+ parts

-

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-

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36,278

$0.180

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Semicontronic

India . 34,728 parts In-Stock

1+ parts

$0.180

100+ parts

$0.176

1k+ parts

$0.175

10k+ parts

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34,728

$0.180

$0.176

$0.175

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Corphita

USA . 4,803 parts In-Stock

1+ parts

$0.191

100+ parts

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4,803

$0.191

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$0.215

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$0.215

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$0.215

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300

$0.215

$0.215

$0.215

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Argo Parts USA

USA . 2,510 parts In-Stock

1+ parts

$0.235

100+ parts

-

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10k+ parts

$0.228

2,510

$0.235

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-

$0.228

Continental Prestige Electronics

USA . 1,890 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

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$0.230

1,890

$0.235

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-

$0.230

Parana Technologies

USA . 1,685 parts In-Stock

1+ parts

$12.043

100+ parts

-

1k+ parts

$12.449

10k+ parts

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1,685

$12.043

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$12.449

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DigiPath Technology Company

USA . 1,042 parts In-Stock

1+ parts

$13.261

100+ parts

$12.200

1k+ parts

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1,042

$13.261

$12.200

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ChromeModa Solutions

Germany . 4,712 parts In-Stock

1+ parts

$13.532

100+ parts

$11.096

1k+ parts

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4,712

$13.532

$11.096

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IDEA Electronic Components Group

UK . 637 parts In-Stock

1+ parts

$13.532

100+ parts

$12.855

1k+ parts

$12.179

10k+ parts

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637

$13.532

$12.855

$12.179

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Corohmni

South Africa . 291 parts In-Stock

1+ parts

$26.414

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291

$26.414

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Perfect Parts

USA . 2,278 parts In-Stock

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2,278

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74LVC1G0832YZPR logic gate. Designed for high-performance applications, this surface-mount device offers a fast propagation delay of 5.9 ns, making it ideal for time-sensitive projects. With a low supply voltage of 1.8V and minimal power consumption, this logic gate provides efficiency without sacrificing performance. Trust in Texas Instruments for cutting-edge technology and innovative solutions that exceed customer expectations. Elevate your designs with the SN74LVC1G0832YZPR and unlock endless possibilities in logic gate applications.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 5.9 ns

This low propagation delay ensures fast performance and efficient operation.

Surface Mount: YES

Easy to install and suitable for compact designs.

No. of Inputs: 3

Ideal for applications requiring multiple input signals.

Package Shape: RECTANGULAR

Provides a versatile shape for easy integration into various systems.

Nominal Supply Voltage / Vsup (V): 1.8

Compatible with a wide range of power supplies for flexibility in usage.

Load Capacitance (CL): 50 pF

Can handle a moderate load capacitance for stable operation.

Power Supplies (V): 3.3

Works well with standard power supply voltages.

No. of Terminals: 6

Sufficient terminals for connecting to other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Offers a compact and space-saving package style.

Maximum I (ol): 32 Amp

Capable of handling high output current for demanding applications.

Propagation Delay (tpd): 17.5 ns

Provides a balance between speed and power consumption.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in a wide range of temperature conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Ensures good conductivity and durability of the terminals.

Terminal Position: BOTTOM

Convenient terminal position for easy connectivity.

Maximum Seated Height: 0.5 mm

Low profile design for space-constrained applications.

Width: 0.9 mm

Compact width for efficient use of board space.

Minimum Supply Voltage (Vsup): 1.65 V

Can operate at low supply voltages for energy efficiency.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes.

Length: 1.4 mm

Provides a suitable length for integration into different systems.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements.

Technology: CMOS

Utilizes CMOS technology for efficient and reliable operation.

Terminal Form: BALL

Offers a secure terminal form for stable connections.

Packing Method: TR

Suitable packing method for easy handling and storage.

Terminal Pitch: 0.5 mm

Fine pitch for precise connections.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle high supply voltages for versatile applications.

Maximum Power Supply Current (ICC): 0.01 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Logic Gates SN74LVC1G0832YZPR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-XBGA-B6

JESD-609 Code:

e1

Length:

1.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74LVC1G0832YZPR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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