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SN74LVC1G17DCKR

Texas Instruments

SN74LVC1G17DCKR by Texas Instruments

SN74LVC1G17DCKR by Texas Instruments is a CMOS logic gate with 5.5 ns propagation delay, 3.3V nominal voltage, and 50 pF load capacitance. Ideal for automotive applications due to its Schmitt Trigger feature and thin profile package style.

Median Price

$0.257

Lifecycle Status

Suppliers In-Stock

45

In-Stock Inventory

1k+

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Arrow

USA . 54 parts In-Stock

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$0.257

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$0.108

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DigiKey

USA . 485,717 parts In-Stock

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$0.260

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$0.135

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$0.113

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Mouser Electronics

USA . 6,169 parts In-Stock

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RS (Exports)

UK . 1,395 parts In-Stock

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Chip1Stop

Japan . 9 parts In-Stock

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DF Sales Co.

USA . 5,500 parts In-Stock

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DF Sales Co.

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EXC GmbH

Germany . 1,938 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Maritex

Poland . 63 parts In-Stock

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$0.046

63

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Tomark Electronics Ltd

UK . 3,000 parts In-Stock

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Digiode

USA . 4,386 parts In-Stock

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NAC Semi

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Component Electronics Inc.

Canada . 1,032 parts In-Stock

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Cyclops Electronics Ltd

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Global Solutions Electronics Company

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iBuyXS LLC

. 201,000 parts In-Stock

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$0.010

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Ampacity Inc.

Singapore . 48,792 parts In-Stock

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Argo Parts USA

USA . 2,380 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Modulus Dynamics

Lithuania . 2,880 parts In-Stock

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$0.073

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Corohmni

South Africa . 221 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$0.075

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Semicontronic

India . 48,755 parts In-Stock

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$0.093

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$0.091

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$0.090

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Corphita

USA . 389 parts In-Stock

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$0.231

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Parana Technologies

USA . 924 parts In-Stock

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$24.301

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$24.966

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DigiPath Technology Company

USA . 1,031 parts In-Stock

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$26.759

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ChromeModa Solutions

Germany . 490 parts In-Stock

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$27.305

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$22.390

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$27.305

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IDEA Electronic Components Group

UK . 455 parts In-Stock

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$27.305

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$25.940

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$24.574

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$27.305

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$24.574

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Perfect Parts

USA . 814,779 parts In-Stock

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Canada . 98,923 parts In-Stock

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India . 73,697 parts In-Stock

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Singapore . 60,000 parts In-Stock

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Authorized Procurement Solutions

USA . 11,532 parts In-Stock

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Israel . 10,000 parts In-Stock

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Spain . 8,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,401 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,373 parts In-Stock

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USA . 3,000 parts In-Stock

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Brazil . 1,905 parts In-Stock

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Lucentia Tech

USA . 1,905 parts In-Stock

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$0.070

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$0.070

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Lixinc

USA . 1,700 parts In-Stock

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Allen Electronics Distributors

USA . 1,500 parts In-Stock

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$0.188

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USA . 255 parts In-Stock

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Overview

Experience unmatched quality and reliability with the Texas Instruments SN74LVC1G17DCKR Logic Gates. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology to meet all your needs. Ideal for a variety of applications, this product offers fast propagation delay, low power consumption, and a wide operating temperature range. Whether you're in the automotive sector or working on a specialized project, the SN74LVC1G17DCKR provides exceptional performance and value. Upgrade to Texas Instruments for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 5.5 ns

Fast response time ensures quick processing of signals.

Surface Mount: YES

Easy to install on circuit boards, saving time and effort.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with commonly used supply voltages in electronics.

Load Capacitance (CL): 50 pF

Efficiently handles signal loads to prevent voltage drops.

Power Supplies (V): 3.3

Consistent power supply for proper functioning.

No. of Terminals: 5

Simplified connectivity for easy integration into circuits.

Maximum I (ol): 24 Amp

Can handle higher output currents for versatile applications.

Propagation Delay (tpd): 11 ns

Balanced delay time for accurate signal processing.

Maximum Operating Temperature: 125 °C

Suitable for a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Maintains functionality in low-temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Corrosion-resistant finish for longevity and reliability.

Technology: CMOS

Efficient and low power consumption technology.

Technical Specifications

Logic Gates SN74LVC1G17DCKR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G17DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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