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MM74HC04MTCX

Onsemi

MM74HC04MTCX by Onsemi

MM74HC04MTCX by Onsemi is a CMOS logic gate with 6 functions, 24 ns propagation delay, and 50 pF load capacitance. It operates at a supply voltage range of 2-6V and has a max operating temperature of 85°C. Ideal for industrial applications requiring fast signal processing in compact designs.

Median Price

$0.195

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

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Chip1Stop

Japan . 190 parts In-Stock

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$0.083

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Adafruit Industries

USA . 450 parts In-Stock

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Mouser Electronics

USA . 9,842 parts In-Stock

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$0.390

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$0.209

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$0.176

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$0.167

9,842

$0.390

$0.209

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$0.167

DigiKey

USA . 3,773 parts In-Stock

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$0.390

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Newark

USA . 2,114 parts In-Stock

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Arrow

USA . 117,500 parts In-Stock

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Verical

USA . 115,000 parts In-Stock

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Avnet

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Rochester

USA . 2,920 parts In-Stock

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Future Electronics

Canada . 2,500 parts In-Stock

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Farnell

UK . 2,494 parts In-Stock

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Element14

Singapore . 2,494 parts In-Stock

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$0.280

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Flip Electronics (Authorized)

USA . 783 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 2,563 parts In-Stock

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$0.079

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Nova Conductors

Japan . 62 parts In-Stock

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Component Electronics Inc.

Canada . 80 parts In-Stock

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$1.000

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Vyrian

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Cyclops Electronics Ltd

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Chip Stock

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NAC Semi

USA . 5,000 parts In-Stock

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Holdelec - ElecDif-Pro

France . 2,986 parts In-Stock

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IBS Electronics

USA . 2,500 parts In-Stock

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Bristol Electronics

USA . 1,400 parts In-Stock

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Flip Electronics

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ACDS - Activité Composants Distribution Service

France . 460 parts In-Stock

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Semi Source

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Ampacity Inc.

Singapore . 9,089 parts In-Stock

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$0.071

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Corphita

USA . 1,038 parts In-Stock

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Corohmni

South Africa . 122 parts In-Stock

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Semicontronic

India . 9,045 parts In-Stock

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$0.149

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Continental Prestige Electronics

USA . 6,657 parts In-Stock

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Argo Parts USA

USA . 32 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Microchip USA

USA . 6,809 parts In-Stock

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Aztec Data Supply Inc.

USA . 73 parts In-Stock

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Perfect Parts

USA . 32,623 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,782 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 9,550 parts In-Stock

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Problanco Electronics

Mexico . 7,004 parts In-Stock

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Kulean Microsystems

USA . 6,310 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 3,298 parts In-Stock

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iodParts Technologies Inc.

India . 2,343 parts In-Stock

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$0.328

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TANS Electronics

Latvia . 2,218 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 697 parts In-Stock

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Kepictronics

USA . 512 parts In-Stock

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Overview

Enhance your electronic designs with the MM74HC04MTCX by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Logic Gates products. Whether you're working on a project that requires signal inversion, waveform generation, or logic circuits, this versatile component with its fast propagation delay and low power consumption will surely meet your needs. Trust Onsemi to provide you with the value, benefits, and advantages you seek in electronic components. Elevate your designs with the MM74HC04MTCX today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 24 ns

With a fast propagation delay, this product is efficient and can process signals quickly.

Surface Mount: YES

Surface mount technology allows for easy and space-saving installation on circuit boards.

No. of Functions: 6

Having multiple functions in one package increases efficiency and reduces the need for additional components.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V is common and compatible with many electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and improving overall performance.

Power Supplies (V): 2/6

This product can operate within a wide range of power supply voltages, providing flexibility in different applications.

No. of Terminals: 14

Having a sufficient number of terminals allows for easy connectivity and integration into circuits.

Maximum I (ol): 4 Amp

The high maximum output current capacity ensures reliable operation under different load conditions.

Propagation Delay (tpd): 120 ns

Although not the fastest, the propagation delay of 120 ns is still within acceptable limits for most applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes this product suitable for industrial and harsh environment applications.

Minimum Operating Temperature: -40 °C

This product can operate in extremely cold conditions without any performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish enhances the product's conductivity and durability, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and better connectivity in circuits.

Maximum Seated Height: 1.2 mm

The low seated height enables compact and space-efficient designs when using this product.

Width: 4.4 mm

The small width of the package makes it suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 2 V

The product can operate at low supply voltages, conserving power and extending battery life.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures proper soldering and assembly of the product.

Length: 5 mm

The compact length of the package helps in creating smaller and more portable electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that this product is designed to withstand harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and easy soldering during assembly.

Packing Method: TR

This packing method ensures safe transportation and storage of the product before and during its use.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting of components on circuit boards.

Maximum Supply Voltage (Vsup): 6 V

The product can handle higher supply voltages, providing a wider operating range for different applications.

Technical Specifications

Logic Gates MM74HC04MTCX attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MM74HC04MTCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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