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MC14093BDTR2G

Onsemi

MC14093BDTR2G by Onsemi

MC14093BDTR2G by Onsemi is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage of 5V, with a propagation delay of 250ns. Ideal for military-grade applications due to its Schmitt Trigger feature and wide temperature range from -55°C to 125°C.

Median Price

$0.283

Lifecycle Status

Suppliers In-Stock

27

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1k+

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Mouser Electronics

USA . 3,737 parts In-Stock

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$0.510

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$0.297

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DigiKey

USA . 5,363 parts In-Stock

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$0.297

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$0.256

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Element14

Singapore . 1,396 parts In-Stock

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$1.670

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1,396

$1.670

$0.563

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$0.333

Adafruit Industries

USA . 2,000 parts In-Stock

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$15.473

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$14.699

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EBV Elektronik

Germany . 235,000 parts In-Stock

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Arrow

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Verical

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Rochester

USA . 28,659 parts In-Stock

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$0.283

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Farnell

UK . 5,013 parts In-Stock

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Chip1Stop

Japan . 2,393 parts In-Stock

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Digiode

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DF Sales Co.

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DF Sales Co.

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Nova Conductors

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Chip Stock

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NAC Semi

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Flip Electronics

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Prism Electronics

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Holdelec - ElecDif-Pro

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Cyclops Electronics Ltd

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IBS Electronics

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Vyrian

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Bristol Electronics

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Ampacity Inc.

Singapore . 2,081 parts In-Stock

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Semicontronic

India . 1,754 parts In-Stock

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Corohmni

South Africa . 372 parts In-Stock

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Corphita

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Argo Parts USA

USA . 709 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$15.473

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$14.699

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Aztec Data Supply Inc.

USA . 3,389 parts In-Stock

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Perfect Parts

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iodParts Technologies Inc.

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Glotronic Ltd.

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UHIMA Technologies

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Continental Prestige Electronics

USA . 708 parts In-Stock

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Problanco Electronics

Mexico . 66 parts In-Stock

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Netroflash

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GreenTree Electronics

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Overview

Unlock the power of advanced logic gates with the MC14093BDTR2G by Onsemi. Crafted with precision and expertise, this high-quality component offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this versatile product delivers reliable operation and efficient functionality. Embrace innovation and streamline your projects with the MC14093BDTR2G, where quality meets value for a superior customer experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 250 ns

Fast propagation delay ensures quick response times in logic operations.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage of 5V makes it compatible with common electronic systems.

Schmitt Trigger: YES

Schmitt trigger functionality helps to eliminate noise and signal distortion, improving the reliability of the logic gates.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates efficient and reliable.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows the logic gates to function in harsh environments and extreme conditions.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures the reliability and stability of the logic gates under varying thermal conditions.

Technical Specifications

Logic Gates MC14093BDTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MC14093BDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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