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MC14584BCPG

Onsemi

MC14584BCPG by Onsemi

MC14584BCPG by Onsemi is a 6-function logic gate with Schmitt Trigger technology. It operates at a supply voltage range of 3-18V and has a propagation delay of 250ns. Ideal for military-grade applications requiring reliable signal processing in harsh environments.

Median Price

$0.265

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Nova Conductors

Japan . 700 parts In-Stock

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$0.233

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Vyrian

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Digiode

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Bristol Electronics

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Atlantic Semiconductor

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Sensible Micro Corp

USA . 77 parts In-Stock

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$0.298

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$0.267

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Semtec, LLC

USA . 67 parts In-Stock

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ComSIT Distribution GmbH

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Argo Parts USA

USA . 3,594 parts In-Stock

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$0.175

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$0.170

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Continental Prestige Electronics

USA . 511 parts In-Stock

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$0.175

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$0.171

511

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Netroflash

USA . 1,000 parts In-Stock

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$0.233

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$0.221

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$0.216

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$0.233

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Corohmni

South Africa . 222 parts In-Stock

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$0.298

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Benley Electronics

USA . 1 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 421 parts In-Stock

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$5.500

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Ampacity Inc.

Singapore . 528 parts In-Stock

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$11.000

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Aztec Data Supply Inc.

USA . 443 parts In-Stock

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$12.498

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$12.078

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Semicontronic

India . 1,376 parts In-Stock

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$27.000

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$26.325

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$26.190

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Lixinc

USA . 9,458 parts In-Stock

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A-Z Elektronik GmbH

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Problanco Electronics

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SupplyDigital Components

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S.R.D Solutions

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Kulean Microsystems

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UHIMA Technologies

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Microchip USA

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Kepictronics

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Overview

Enhance your electronic projects with the MC14584BCPG from Onsemi, a top-tier manufacturer known for delivering high-quality logic gates. With a package body material of plastic/epoxy and 6 functions packed into a compact rectangular shape, this component offers reliable performance with a propagation delay of 250 ns. Ideal for applications requiring precision and speed, this versatile product operates seamlessly within a wide temperature range and various power supplies. Elevate your designs with the MC14584BCPG and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing circuits.

No. of Functions: 6

Offers versatility and flexibility in circuit design, allowing for multiple functions to be implemented with one component.

Minimum Operating Temperature: -55 °C

Can operate in extreme low temperature conditions, making it suitable for various environments.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliability in harsh operating conditions.

Technology: MOS

Utilizes Metal-Oxide-Semiconductor technology, known for its low power consumption and fast switching speeds.

Technical Specifications

Logic Gates MC14584BCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC14584BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5961-01-594-7922, 5961015947922

NIIN

015947922

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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