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MC14001BDG

Onsemi

MC14001BDG by Onsemi

MC14001BDG by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It operates at 5V, has a propagation delay of 250ns, and can withstand temperatures from -55 to 125°C. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.306

Lifecycle Status

Suppliers In-Stock

32

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,309 parts In-Stock

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$0.101

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$0.079

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$0.101

$0.079

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DigiKey

USA . 1,093 parts In-Stock

1+ parts

$0.540

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$0.311

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$0.259

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$0.232

1,093

$0.540

$0.311

$0.259

$0.232

Mouser Electronics

USA . 66 parts In-Stock

1+ parts

$0.540

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$0.320

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66

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$0.320

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Element14

Singapore . 1,602 parts In-Stock

1+ parts

$0.614

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$0.408

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$0.329

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$0.310

1,602

$0.614

$0.408

$0.329

$0.310

Farnell

UK . 7,132 parts In-Stock

1+ parts

$0.698

100+ parts

$0.362

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$0.259

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$0.232

7,132

$0.698

$0.362

$0.259

$0.232

Newark

USA . 3,049 parts In-Stock

1+ parts

$1.090

100+ parts

$0.405

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$0.304

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$0.245

3,049

$1.090

$0.405

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$0.245

Rochester

USA . 84,471 parts In-Stock

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$0.281

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$0.208

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Verical

USA . 5,280 parts In-Stock

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$0.099

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Future Electronics

Canada . 4,588 parts In-Stock

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$0.153

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$0.147

4,588

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Master Electronics

USA . 3,785 parts In-Stock

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EBV Elektronik

Germany . 2,530 parts In-Stock

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Avnet

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Chip1Stop

Japan . 155 parts In-Stock

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$0.331

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$0.199

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155

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RS (Exports)

UK . 62 parts In-Stock

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$0.270

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$0.243

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62

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$0.243

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Distributors (In-Stock)

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Digiode

USA . 2,447 parts In-Stock

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$0.218

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Nova Conductors

Japan . 45 parts In-Stock

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$0.274

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45

$0.274

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TME

Poland . 29 parts In-Stock

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$0.460

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$0.460

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IBS Electronics

USA . 18,548 parts In-Stock

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$0.224

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Vyrian

USA . 8,915 parts In-Stock

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NAC Semi

USA . 8,800 parts In-Stock

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$0.312

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$0.284

8,800

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$0.312

$0.284

Flip Electronics

USA . 5,885 parts In-Stock

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EMSNET

USA . 3,282 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 344 parts In-Stock

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ComSIT Distribution GmbH

Germany . 236 parts In-Stock

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Prism Electronics

USA . 122 parts In-Stock

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Sunrise Surplus Inc.

USA . 70 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 55 parts In-Stock

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Extreme Components

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Inventory MP

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Bristol Electronics

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Amalfi Trading

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Bas Electronics GmbH & Co. KG

Germany . 7 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 13,987 parts In-Stock

1+ parts

$0.097

100+ parts

$0.095

1k+ parts

$0.094

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13,987

$0.097

$0.095

$0.094

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Ampacity Inc.

Singapore . 13,523 parts In-Stock

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$0.097

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13,523

$0.097

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Corphita

USA . 1,330 parts In-Stock

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$0.206

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Corohmni

South Africa . 450 parts In-Stock

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$0.229

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$0.229

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Continental Prestige Electronics

USA . 2,539 parts In-Stock

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$0.273

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$0.268

2,539

$0.273

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Argo Parts USA

USA . 865 parts In-Stock

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$0.273

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$0.265

865

$0.273

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$0.265

Netroflash

USA . 1,000 parts In-Stock

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$0.274

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$0.268

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$0.274

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Benley Electronics

USA . 15 parts In-Stock

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$0.500

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$0.500

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Aztec Data Supply Inc.

USA . 1,271 parts In-Stock

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$27.722

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Perfect Parts

USA . 27,154 parts In-Stock

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Lixinc

USA . 9,736 parts In-Stock

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SupplyDigital Components

Austria . 4,410 parts In-Stock

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Eastek

USA . 3,905 parts In-Stock

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GreenTree Electronics

Israel . 3,080 parts In-Stock

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TANS Electronics

Latvia . 1,754 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Kulean Microsystems

USA . 1,419 parts In-Stock

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Problanco Electronics

Mexico . 1,310 parts In-Stock

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UHIMA Technologies

Türkiye . 729 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 55 parts In-Stock

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Computer Components Inc. - USA

USA . 45 parts In-Stock

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Overview

Enhance your electronics projects with the MC14001BDG logic gates from Onsemi, a trusted manufacturer known for superior quality and reliability. With its versatile applications in digital circuits, this product offers customers unmatched value and benefits. Experience fast propagation delay and efficient performance, making it a must-have component for your designs. Upgrade your projects today with the MC14001BDG and unlock endless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material offers a good balance of durability and cost-effectiveness.

Propagation Delay At Nominal Supply:

250 ns - Low propagation delay ensures fast and efficient operation.

Surface Mount:

YES - Allows for convenient and secure mounting on circuit boards.

No. of Functions:

4 - Provides versatility for multiple logic operations in a single component.

No. of Inputs:

2 - Suitable for basic logic operations and simple circuit designs.

Package Shape:

RECTANGULAR - Offers compatibility with standard circuit board layouts and designs.

Nominal Supply Voltage / Vsup (V):

5 - Compatible with common supply voltages for easy integration.

Load Capacitance (CL):

50 pF - Can handle moderate capacitance loads without performance issues.

Power Supplies (V):

5/15 - Offers flexibility in power requirements for different applications.

No. of Terminals:

14 - Provides ample connectivity options for various circuit configurations.

Package Style (Meter):

SMALL OUTLINE - Space-saving design for efficient use of board real estate.

Propagation Delay (tpd):

250 ns - Consistent delay ensures reliable performance in synchronous operations.

Maximum Operating Temperature:

125 °C - Can withstand high temperatures for extended operation in harsh environments.

Minimum Operating Temperature:

55 °C - Suitable for use in extreme cold conditions without sacrificing performance.

Terminal Finish:

MATTE TIN - Provides durable and corrosion-resistant terminal coating.

Terminal Position:

DUAL - Offers flexibility in component orientation during installation.

Maximum Seated Height:

1.75 mm - Low profile design for compact and streamlined circuit layouts.

Width:

3.9 mm - Slim body width allows for efficient use of space on the circuit board.

Minimum Supply Voltage (Vsup):

3 V - Compatible with lower supply voltages for energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering and component integrity during assembly.

Peak Reflow Temperature °C:

260 - High reflow temperature tolerance for reliable solder joints.

Length:

8.65 mm - Suitable length for easy placement and routing in circuit board designs.

Temperature Grade:

MILITARY - Meets stringent military-grade standards for durability and reliability.

Technology:

CMOS - Utilizes low power consumption and high noise immunity for efficient operation.

Terminal Form:

GULL WING - Secure terminal design for reliable electrical connections.

Packing Method:

RAIL - Convenient packaging for easy handling and storage.

Terminal Pitch:

1.27 mm - Standard terminal spacing for compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup):

18 V - Can handle higher supply voltages for versatile applications.

Technical Specifications

Logic Gates MC14001BDG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC14001BDG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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